Plastic packaging of LED arrays
First Claim
Patent Images
1. A method of forming a flexible circuit module, comprising:
- adhering a first side of at least one rigid carrier over a first side of a flexible module base;
forming a conductive interconnect pattern having a first portion over a second side of the flexible module base and a plurality of second portions extending through the flexible module base toward the at least one rigid carrier; and
forming at least one solid state device on a second side of the at least one rigid carrier and in electrical contact with the conductive interconnect pattern through the at least one rigid carrier;
wherein the step of forming at least one solid state device comprises forming at least one light emitting diode chip in at least one cavity in the at least one rigid carrier.
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Abstract
There is provided a flexible circuit module, including at least one rigid carrier, at least one solid state device mounted over a first side of the at least one rigid carrier, a flexible base supporting a second side of the at least one rigid carrier, a conductive interconnect pattern on the flexible base, and a plurality of feed through electrodes extending from the first side to the second side of the at least one rigid carrier and electrically connecting the conductive interconnect pattern with the at least one of a plurality of the solid state devices. The solid state devices may be LED chips to form an LED array module.
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Citations
24 Claims
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1. A method of forming a flexible circuit module, comprising:
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adhering a first side of at least one rigid carrier over a first side of a flexible module base;
forming a conductive interconnect pattern having a first portion over a second side of the flexible module base and a plurality of second portions extending through the flexible module base toward the at least one rigid carrier; and
forming at least one solid state device on a second side of the at least one rigid carrier and in electrical contact with the conductive interconnect pattern through the at least one rigid carrier;
wherein the step of forming at least one solid state device comprises forming at least one light emitting diode chip in at least one cavity in the at least one rigid carrier. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 22)
forming vias in the flexible module base;
depositing at least one metal layer over the second side of the flexible module base and in the vias; and
patterning the metal layer to form the interconnect.
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6. The method of claim 5, wherein:
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the step of forming vias comprises laser drilling the vias up to a plurality of feed through electrodes embedded in the plurality of rigid carriers after the step of adhering; and
the step of depositing the at least one metal layer comprises plating or sputtering a nickel or copper metal layer to contact the plurality of the feed through electrodes.
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7. The method of claim 5, wherein:
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the step of forming vias further comprises laser drilling the vias through the rigid carrier after the step of adhering; and
the step of depositing the at least one metal layer comprises plating or sputtering a nickel or copper metal layer after the step of adhering such that a portion of the at least one metal layer is exposed on the second side of the plurality of rigid carriers.
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8. The method of claim 5, wherein:
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the step of depositing comprises forming the at least one metal layer prior to the step of adhering; and
the step of adhering comprises adhering the at least one rigid carrier to the flexible module base such that the second portions of the patterned conductive interconnect contact the adhesive layer;
wherein the adhesive layer comprises an anisotropic adhesive layer which is electrically conductive substantially along a first axis between the carriers and the base, but is electrically insulating substantially along a direction perpendicular to the first axis.
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9. The method of claim 2, wherein the step of forming a plurality of light emitting diode chips comprises:
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placing a plurality of light emitting diode chips with the chip pads toward the second side of the plurality of rigid carriers; and
contacting a plurality of embedded feed through electrodes exposed in the second side with the chip pads.
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10. The method of claim 2, wherein the step of forming a plurality of light emitting diode chips comprises:
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placing a plurality of light emitting diode chips with the chip pads away from the second side of the plurality of rigid carriers; and
wire bonding a plurality of lead wires between the chip pads and a plurality of embedded feed through electrodes exposed in the second surface.
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11. The method of claim 2, further comprising:
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forming a reflective material at least on the side walls of the plurality of cavities;
forming an encapsulating layer in the plurality of cavities over the plurality of light emitting diode chips; and
forming a plurality of lens structures over the plurality of light emitting diode chips.
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12. The method of claim 11, further comprising forming a phosphor material over the plurality of light emitting diode chips.
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13. The method of claim 1, further comprising forming at least two feed through electrodes through the at least one rigid carrier which provide the electrical contact between the conductive interconnect pattern and the at least one light emitting diode chip.
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22. The method of claim 13, wherein the step of forming the at least two feed through electrodes comprises:
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placing at least two conductive posts into a mold cavity;
filling the mold cavity with a fluid insulating material;
solidifying the fluid insulating material to form the at least one rigid carrier, wherein at least two surfaces of the at least two conductive posts are exposed to form the at least two feed through electrodes in the at least one rigid carrier.
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14. A method of forming a flexible circuit module, comprising:
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placing at least two conductive posts into a mold cavity;
filling the mold cavity with a fluid insulating material;
solidifying the fluid insulating material to form at least one rigid carrier, wherein at least two surfaces of the at least two conductive posts are exposed to form at least two feed through electrodes in the at least one rigid carrier;
adhering a first side of the at least one rigid carrier over a first side of a flexible module base;
forming a conductive interconnect pattern having a first portion over a second side of the flexible module base and a plurality of second portions extending through the flexible module base toward the at least one rigid carrier;
forming at least one solid state device on a second side of the at least one rigid carrier and in electrical contact with the conductive interconnect pattern through the at least one rigid carrier. - View Dependent Claims (15, 16, 23, 24)
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17. A method of forming a flexible circuit module, comprising:
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forming a plurality of feed through electrodes extending from a first side to a second side of at least one rigid carrier, wherein the at least one rigid carrier comprises an insulating material;
adhering the first side of the at least one rigid carrier over a first side of a flexible module base, wherein the flexible module base comprises an insulating material;
forming a conductive interconnect pattern having a first portion over a second side of the flexible module base and a plurality of second portions extending through the flexible module base and contacting the plurality of feed through electrodes; and
forming at least one light emitting diode on the second side of the at least one rigid carrier and in electrical contact with the feed through electrodes. - View Dependent Claims (18, 19)
forming vias in the flexible module base extending through the adhesive layer, such that the vias expose the plurality of the feed through electrodes;
depositing at least one metal layer over the second side of the flexible module base and in the vias; and
patterning the metal layer to form the conductive interconnect.
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20. A method of forming a flexible circuit module, comprising:
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forming a plurality of feed through electrodes extending from a first side to a second side of at least one rigid carrier, wherein the at least one rigid carrier comprises an insulating material;
forming a conductive interconnect pattern having a first portion over a second side of a flexible module base and a plurality of second portions extending through the flexible module base, wherein the flexible module base comprises an insulating material;
adhering the first side of the at least one rigid carrier over a first side of a flexible module base using an anisotropic adhesive layer; and
forming at least one light emitting diode on the second side of the at least one rigid carrier and in electrical contact with the feed through electrodes;
wherein;
the anisotropic adhesive layer is located between the first side of the at least one rigid carrier and the first side of the flexible module base and in electrical contact with the plurality of feed through electrodes; and
the anisotropic adhesive layer is electrically conductive substantially along a first axis between the at least one rigid carrier and the flexible module base, but is electrically insulating substantially along a direction perpendicular to the first axis. - View Dependent Claims (21)
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Specification