Evacuated hybrid ovenized oscillator

• US 6,731,180 B1
• Filed: 10/22/2001
• Issued: 05/04/2004
• Est. Priority Date: 10/20/2000
• Status: Expired due to Term

• Current Assignee: Microsemi Corporation (Microchip Technology Incorporated)
• Original Assignee: Delaware Capital Formation Incorporated (Dover Corporation)
• Inventors: Adler, Joseph V., Li, Jacob M., Clark, Roger L.
• Primary Examiner(s): Kinkead, Arnold M.
• Application Number:
  US10/056,958
• Time in Patent Office: 925 Days
• Field of Search: 310/343, 310/346, 310/340, 310/341, 310/342, 310/344, 331/68, 331/69, 331/158, 331/176
• US Class Current: 331/176
• CPC Class Codes: H03B 5/326 the resonator being an acoustic wave device, e.g. SAW or BAW device
• CPC Class Codes: H03L 1/04 Constructional details for maintaining temperature constant

Abstract

The present invention is for a thermally controlled package for oscillators, particularly evacuated miniature surface acoustical wave oscillators (EMSO) devices. In a preferred embodiment the surface acoustical wave device is bonded directly to a heated substrate. The package is evacuated to improve temperature characteristics. A temperature heater, sensor, and control controller are utilized to maintain the internal package temperature above ambient. In one embodiment there is an additional substrate layer that house components that are not sensitive to temperature with interconnects electrically connecting the heated substrate and the additional substrates.

Claims

1. A temperature controlled structure for an oscillator device, comprising:

a package enclosure having a top, a floor, and side walls, and wherein at least one pin extends from said package enclosure;

a thermal conductive substrate housed within said package enclosure;

a resonator mounted to said thermal conductive substrate;

at least one insulating structure securing said thermal conductive substrate;

a second substrate affixed to said floor, said second substrate having at least one component; and

at least one interconnect electrically connecting said thermal conductive substrate with said second substrate and with said at least one pin.

2. The temperature controlled structure according to claim 1, wherein said resonator is a surface acoustical wave device and directly bonded to said thermal conductive substrate.

3. The temperature controlled structure according to claim 1, wherein said resonator is a bulk acoustical wave device and secured by a plurality of clips extending from said thermal conductive substrate.

4. The temperature controlled structure according to claim 1, further comprising a heater device, temperature sensor and temperature control circuitry.

5. The temperature controlled structure according to claim 1, further comprising at least one additional substrate disposed between said second substrate and said thermal conductive substrate.

6. The temperature controlled structure according to claim 1, wherein said package is vacuum evacuated.

7. The temperature controlled structure according to claim 1, wherein said thermal conductive substrate and said second substrate are ceramic.

8. The temperature controlled structure according to claim 1, wherein said at least one insulating structure is a glass posts.

9. The temperature controlled structure according to claim 1, further comprising a temperature hood covering said thermal conductive substrate.

20. The temperature controlled structure according to claim 9, further comprising at least one temperature sensitive component on said thermal conductive substrate and covered by said temperature hood.

21. The temperature controlled structure according to claim 1, wherein said at least one component is chosen from the group of components consisting of:

PI controller, heater, differential amplifier, and output amplifier.

10. A temperature controlled package for an oscillator, comprising:

a device enclosure having a top, a floor, and side walls, and wherein at least one pin extends from said package, wherein said device enclosure is evacuated;

a thermal conductive substrate housed within said device enclosure;

a surface acoustical wave device directly bonded to said thermal conductive substrate;

at least one insulating post securing said thermal conductive substrate;

a second substrate level secured to said floor by at least one insulating structure wherein said second substrate level houses at least one component;

a temperature controller for maintaining an internal temperature above an ambient temperature, wherein said controller uses at least one temperature sensor and at least one heater to maintain said internal temperature; and

at least one interconnect electrically connecting said thermal conductive substrate to said at least one pin and said second substrate level.

11. The temperature controlled package for an oscillator according to claim 10, further comprising at least one additional substrate level disposed between said second substrate level and said thermal conductive substrate.

12. The temperature controlled package for an oscillator according to claim 11, wherein said at least one component is mounted to said at least one additional substrate level.

13. The temperature controlled package for an oscillator according to claim 10, further comprising a temperature hood covering said thermal conductive substrate.

14. A resonator package with thermal control, comprising:

device enclosure having a top, a floor, and side walls, and wherein at least one pin extends from said device enclosure;

a thermal conductive substrate having a plurality of temperature sensitive components mounted to said thermal conductive substrate;

a plurality of insulating posts securing said thermal conductive substrate;

a second substrate affixed to an interior surface of said floor of said device enclosure, with a plurality of temperature insensitive components mounted to said second substrate;

at least one second substrate interconnect electrically connecting said second substrate with said at least one pin extending from said device enclosure;

at least one thermal conductive substrate interconnect electrically connecting said thermal conductive substrate to said at least one pin extending from said device enclosure; and

a section of printed circuit board, wherein said at least one pin is electrically connected with said printed circuit board and wherein said device enclosure is physically mated with said printed circuit board.

15. The resonator package with thermal control according to claim 14, wherein said resonator package is a surface mount device.

16. The resonator package with the thermal control according to claim 14, further comprising at least one interconnect electrically connecting said thermal conductive substrate with said second substrate.

17. The resonator package with thermal control according to claim 14, further comprising a temperature hood covering said plurality of temperature sensitive components on said thermal conductive substrate.

18. The resonator packager with thermal control according to claim 14, wherein one of said plurality of temperature sensitive components is a surface acoustical wave device directly bonded to said thermal conductive substrate.

19. The resonator package with thermal control according to claim 14, wherein one of said plurality of temperature sensitive components is a bulk acoustical wave device secured by a plurality of clips to said thermal conductive substrate.