Method for mounting electronic circuit chip

• US 6,731,509 B1
• Filed: 09/14/2001
• Issued: 05/04/2004
• Est. Priority Date: 11/30/1998
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Usami, Mitsuo, Yagi, Hiroyuki, Tsuji, Kazutaka, Okamoto, Chikashi, Takaragi, Kazuo, Sobe, Asahiko, Yasunobu, Chizuko, Tsunemi, Yasuhiro
• Primary Examiner(s): Vigushin, John B.
• Application Number:
  US09/856,758
• Time in Patent Office: 963 Days
• Field of Search: 361/749-751, 361/767-771, 174/254, 174/256, 174/258, 174/259, 257/679, 235/488, 235/489, 235/491, 235/492, 428/211, 340/572.1, 340/572.5, 340/572.7, 340/572.8, 438/107, 438/110, 298/30
• US Class Current: 361/749
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

Claims

1. A foldable sheet having a rectangular sheet surface, and mounted thereon with an electric circuit having a planar electronic circuit chip, a planar capacitor and an antenna, characterized in that the planar surface of the capacitor has a size which is slightly smaller than that of each of rectangular areas which are obtained by sectioning the sheet surface by n×

m (where n and m are integers larger than

     2), and

the capacitor, the electronic circuit chip and the antenna are mounted on the sheet so that the planar surface of the capacitor and a planar surface of the electronic circuit chip are in parallel with the sheet surface, the planar surface of the capacitor is accommodated within one of the rectangular areas obtained by sectioning the sheet surface by n×

m, as viewed in a direction perpendicular to the sheet surface, and the planar surface of the electronic circuit chip and the contour of the antenna are accommodated within the planar surface of the capacitor as viewed in a direction perpendicular to the sheet surface.

2. A planar electronic circuit chip mounted on a flexible sheet, characterized in that the electronic circuit chip has a thickness, a length of the long sides thereof, and a bending strength which satisfy:

3. A sheet mounted thereon with an electronic circuit chip stated in claim 2.

4. A method of mounting a planar electronic circuit chip on a foldable sheet having a rectangular sheet surface together with another planar electric element, characterized by the steps of:

setting the planar surface of the another electric element to be slightly smaller than a size of each of the rectangular areas which are obtained by sectioning the sheet surface by n×

m (where n and m are integers larger than

     2), and

mounting the another electric element and the electronic circuit chip on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are arranged in parallel with the surface of the sheet, the planar surface of the another electric element is accommodated within one of the rectangular areas which are obtained by sectioning the sheet surface by m×

n, as viewed in a direction perpendicular to the sheet surface, and the planar surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

5. A method of mounting an electronic circuit chip as set forth in claim 4, characterized in that a long-rod like or a long planar like electric part is mounted on the sheet so that the longitudinal direction of the electric part is coincident with the sidewise direction of the sheet.

6. A method of mounting an electronic circuit chip as set forth in claim 4, characterized in that the sheet is made of paper.

7. A method of mounting an electronic circuit chip as set forth in claim 6, characterized in that the sheet has a two layer structure, and the electronic circuit chip is mounted between two layers of the sheet.

8. A method of mounting an electronic circuit chip as set forth in claim 6, characterized in that the electronic circuit chip is mounted on the surface of one of two front and rear sheet surfaces of the sheet.

9. A method of mounting an electronic circuit chip as set forth in claim 4, characterized in that the sheet is tape-like.