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Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

  • US 6,733,363 B2
  • Filed: 02/13/2001
  • Issued: 05/11/2004
  • Est. Priority Date: 08/31/1999
  • Status: Expired due to Term
First Claim
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1. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

  • moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium; and

    monitoring the conditioning body by measuring a force transmitted to the support member by the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring includes detecting a frictional force on the conditioning body in a plane generally parallel to a plane of the planarizing surface.

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