Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

• US 6,733,363 B2
• Filed: 02/13/2001
• Issued: 05/11/2004
• Est. Priority Date: 08/31/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US09/782,913
• Publication Number:
  US 20010006873A1
• Time in Patent Office: 1,183 Days
• Field of Search: 451/5, 451/9, 451/10, 451/41, 451/56, 451/285, 451/290, 451/443, 451/444, 451/21
• US Class Current: 451/5
• CPC Class Codes: B24B 49/006 taking regard of the speed
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor

Abstract

A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Claims

1. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, wherein the conditioning body is coupled to a support member for supporting the conditioning body relative to the planarizing medium; and

monitoring the conditioning body by measuring a force transmitted to the support member by the conditioning body to detect a force of the planarizing medium on the conditioning body, wherein monitoring includes detecting a frictional force on the conditioning body in a plane generally parallel to a plane of the planarizing surface.

2. The method of claim 1 wherein the support member includes a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, further wherein monitoring the conditioning body includes detecting a force between the upwardly extending portion and the laterally extending portion with a force sensor.

3. The method of claim 1, further comprising removing material from the planarizing medium while at least one of the conditioning body and the planarizing medium moves relative to the other of the conditioning body and the planarizing medium.

4. The method of claim 1, further comprising adjusting a force applied to the conditioning body approximately normal to the planarizing surface in response to detecting a force of the planarizing medium on the conditioning body.

5. The method of claim 1 wherein moving at least one of the planarizing medium and the conditioning body includes rotating the planarizing medium at a variable rate as the conditioning body moves across the planarizing medium to maintain a relative velocity between the planarizing medium and the conditioning body at an approximately constant value.

6. A method for controlling conditioning of a planarizing medium used for planarizing a microelectronic substrate, the method comprising:

engaging a conditioning body with the planarizing medium and moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium while the conditioning body engages the planarizing medium;

detecting a frictional force between the conditioning body and the planarizing medium; and

controlling at least one of a force between the conditioning body and the planarizing medium and a speed of the conditioning body relative to the planarizing medium in response to detecting the frictional force between the conditioning body and the planarizing medium, wherein controlling the force includes receiving a force signal from a force sensor and transmitting a command signal to an actuator coupled to the conditioning body, and further wherein controlling the speed includes rotating at least one of the conditioning body and the planarizing medium relative to the other about an axis generally normal to the planarizing medium.

7. The method of claim 6 wherein receiving the force signal includes receiving the force signal with a microprocessor and transmitting a command signal includes transmitting the command signal from the microprocessor.

8. The method of claim 6 wherein controlling a force includes adjusting a force on the conditioning body that is approximately normal to a planarizing surface of the planarizing medium.

9. The method of claim 6 wherein controlling a speed of the conditioning body relative to the planarizing medium includes moving the conditioning body radially relative to the planarizing medium.

10. A method for monitoring a polishing pad used for planarizing a microelectronic substrate, the method comprising:

engaging a conditioning body with a planarizing surface of a first polishing pad;

applying a force to the first polishing pad via the conditioning body;

moving at least one of the first polishing pad and the conditioning body relative to the other of the first polishing pad and the conditioning body;

detecting a frictional force of the first polishing pad on the conditioning body in a plane of the planarizing surface;

applying a force to a second polishing pad via the conditioning body;

moving at least one of the second polishing pad and the conditioning body relative to the other of the second polishing pad and the conditioning body;

detecting a second frictional force of the second polishing pad on the conditioning body in a plane of the planarizing surface; and

comparing the first and second frictional forces.

11. The method of claim 10 wherein applying a force includes applying a force to the conditioning body different than a weight of the conditioning body.

12. The method of claim 10 wherein the force is a first force, further comprising conditioning the polishing pad by applying a second force to the conditioner greater than the first force to remove material from the planarizing surface of the polishing pad.

13. A method for monitoring conditioning of a planarizing medium used for planarizing a microelectronic substrate, comprising:

moving at least one of the planarizing medium and a conditioning body relative to the other of the planarizing medium and the conditioning body while the conditioning body is engaged with a planarizing surface of the planarizing medium, the conditioning body being coupled to a support member for supporting the conditioning body relative to the planarizing medium, and wherein moving at least one of the planarizing medium and the conditioning body includes rotating the planarizing medium at a variable rate as the conditioning bode moves across the planarizing medium to maintain a relative velocity between the planarizing medium and the conditioning body at an approximately constant value; and

monitoring the conditioning body by measuring a force transmitted to the support member by the conditioning body to detect a force of the planarizing medium on the conditioning body.

14. The method of claim 13 wherein monitoring the conditioning body includes detecting a frictional force on the conditioning body in a plane generally parallel to a plane of the planarizing surface.

15. The method of claim 13 wherein the support member includes a generally upwardly extending portion coupled to the conditioning body and a generally laterally extending portion pivotably coupled to the upwardly extending portion, further wherein monitoring the conditioning body includes detecting a force between the upwardly extending portion and the laterally extending portion with a force sensor.

16. The method of claim 13, further comprising removing material from the planarizing medium while at least one of the conditioning body and the planarizing medium moved relative to the other of the conditioning body and the planarizing medium.

17. The method of claim 13, further comprising adjusting a force applied to the conditioning body approximately normal to the planarizing surface in response to detecting a force of the planarizing medium on the conditioning body.