Multilayer modules with flexible substrates

• US 6,734,370 B2
• Filed: 09/07/2001
• Issued: 05/11/2004
• Est. Priority Date: 09/07/2001
• Status: Expired due to Term

• Current Assignee: Nytell Software LLC (Intellectual Ventures LLC)
• Original Assignee: Irvine Sensors Corp.
• Inventors: Ozguz, Volkan H., Camien, Andrew Nelson, Pepe, Angel Antonio, Yamaguchi, James Satsuo
• Primary Examiner(s): Zarneke, David A.
• Assistant Examiner(s): Patel, I B
• Application Number:
  US09/948,950
• Publication Number:
  US 20030047353A1
• Time in Patent Office: 977 Days
• Field of Search: 174/260, 174/254, 174/255, 174/256, 174/258, 174/259, 174/261, 361/760, 361/792, 361/793, 361/795, 361/749, 361/750, 361/751, 361/761, 361/763, 361/766, 361/772, 361/782, 361/803, 257/686
• US Class Current: 174/260
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06551 Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0919 Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4635 laminating flexible circuit boards using additional insulating adhesive materials between the boards
• CPC Class Codes: Y10T 156/1089 of discrete laminae to single face of additional lamina
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base

Abstract

A multilayer module includes a first active layer with a first edge and second active layer with a second edge. Each active layer includes a flexible, polymer substrate, at least one electronic element, and a plurality of electrically-conductive traces which provide electrical connection from the respective edge to the electronic element of the active layer. The second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module. The multilayer module further includes a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.

Claims

1. A multilayer module having a plurality of active layers wherein each active layer has a flexible substrate therein, the multilayer module comprising:

a first active layer with a first edge, the first active layer comprising a flexible, polymer substrate, at least one electronic element formed within the the flexible, polymer substrate, and a plurality of electrically-conductive traces which provide electrical connection from the first edge to the electronic element of the first active layer;

a second active layer with a second edge, the second active layer comprising a flexible, polymer substrate, at least one electronic element formed within the the flexible, polymer substrate, and a plurality of electrically-conductive traces which provide electrical connection from the second edge to the electronic element of the second active layer, wherein the second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module; and

a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.

2. The multilayer module of claim 1, wherein the flexible polymer substrate comprises a non-electrically-conductive material.

3. The multilayer module of claim 1, wherein the flexible polymer substrate comprises a polyimide film.

4. The multilayer module of claim 1, wherein the traces of the first active layer and the traces of the second active layer are aligned in registry with one another.

5. The multilayer module of claim 1, wherein the traces comprise a metallic material.

6. The multilayer module of claim 1, wherein the traces comprise a conductive polymeric material.

7. The multilayer module of claim 1, wherein the traces of the first active layer are formed within the first active layer.

8. The multilayer module of claim 1, wherein the traces of the first active layer are formed on the first active layer.

9. The multilayer module of claim 1, wherein the lines comprise deposited metallization.

10. A multilayer module having a plurality of active layers wherein each active layer has a flexible substrate therein, the multilayer module comprising:

a first active layer with a first edge, the first active layer comprising a flexible, polymer substrate, at least one electronic element formed within the the flexible, polymer substrate, and a plurality of electrically-conductive traces which provide electrical connection from the first edge to the electronic element of the first active layer;

a second active layer with a second edge, the second active layer comprising a flexible, polymer substrate, at least one electronic element formed within the the flexible, polymer substrate, and a plurality of electrically-conductive traces which provide electrical connection from the second edge to the electronic element of the second active layer, wherein the second active layer is adhered to the first active layer so that the first edge and second edge are aligned with each other thereby forming a side of the multilayer module;

a segmentation layer adhered to the second active layer, the segmentation layer comprising a thermally-conductive material; and

a plurality of electrically-conductive lines along the side of the multilayer module, the lines providing electrical connection to the traces.

11. A multilayer module having a plurality of layers wherein each layer has a flexible substrate therein, the multilayer module comprising:

a first layer having a top side and bottom side, the first layer comprising a flexible, polymer substrate, at least one electronic element formed within the the flexible, polymer substrate, and a plurality of electrically-conductive traces; and

a second layer having a top side and bottom side, the second layer comprising a flexible, polymer substrate, at least one electronic element formed within the the flexible, polymer substrate, and a plurality of electrically-conductive traces, wherein the bottom side of the second layer is adhered to the top side of the first layer and wherein the thickness of the combination of the first and second layers is less than or equal to approximately 0.005″

.

12. The multilayer module of claim 11, wherein the thickness of the combination of the first and second layers is between approximately 0.001″

and 0.005″

.

13. A multilayer module having a plurality of electronic elements, the multilayer module fabricated by a process comprising:

providing a plurality of active layer sheets, each active layer sheet comprising a flexible, non-electrically-conductive substrate sheet and a plurality of arrayed active areas with borders of adjacent arrayed active areas defining dicing lines, each active area comprising at least one electronic element and a plurality of electrically-conductive traces which provide electrical connection from an edge of the arrayed active area to the electronic element;

providing a plurality of segmentation layer sheets, each segmentation layer sheet comprising a flexible, non-electrically-conductive substrate sheet and a plurality of arrayed segmentation areas with borders of adjacent arrayed segmentation areas defining dicing lines, each segmentation area comprising a thermally-conductive material;

stacking a plurality of active layer sheets upon one another with adhesive between the active layer sheets, the arrayed active areas of the active layer sheets aligned in registry with one another;

stacking at least one segmentation layer sheet with the plurality of active layer sheets with adhesive between the segmentation layer sheet and the active layer sheets, the dicing lines of the segmentation layer sheet in registry with the dicing lines of the active layer sheets, thereby assembling an arrayed module pre-form corresponding to an arrayed multilayer module;

stacking a plurality of arrayed module pre-forms, the arrayed module pre-forms oriented with at least one segmentation layer sheet between each pair of arrayed module pre-forms and with a thermoplastic adhesive material applied to the segmentation layer sheets, thereby assembling a stack of arrayed module pre-forms;

applying pressure and heat to the stack of arrayed module pre-forms to laminate the active layer sheets and the segmentation layer sheets together, thereby forming a stack of arrayed multilayer modules;

cutting the stack of arrayed multilayer modules along the dicing lines, thereby dividing the stack of arrayed multilayer modules into stacks of multilayer modules having sides formed by edges of the active areas and segmentation areas;

forming electrically-conductive lines along at least one side of the stack of multilayer modules, the lines providing electrical connection to the traces; and

segmenting the stack of multilayer modules into individual multilayer modules by displacing the multilayer modules relative to one another while applying heat to the thermallyconductive material to release the thermoplastic adhesive.