Component built-in module and method for producing the same

• US 6,734,542 B2
• Filed: 12/27/2001
• Issued: 05/11/2004
• Est. Priority Date: 12/27/2000
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Komatsu, Shingo, Nakatani, Seiichi, Asahi, Toshiyuki, Sugaya, Yasuhiro
• Primary Examiner(s): CHU, CHRIS C
• Application Number:
  US10/033,322
• Publication Number:
  US 20020117743A1
• Time in Patent Office: 866 Days
• Field of Search: 257/724, 257/687, 257/690, 257/788, 257/795, 361/760, 361/782, 361/795, 361/792, 361/764, 361/762, 361/761, 310/340, 310/313, 264/272.11, 156/233, 428/209, 174/255, 174/258, 174/262, 174/264, 174/266
• US Class Current: 257/687
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/187 the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
• CPC Class Codes: H05K 1/188 manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
• CPC Class Codes: H05K 2201/0209 : Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2203/061 : of previously made multilayered subassemblies
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4614 : the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: H05K 3/462 : characterized by laminating only or mainly similar double-sided circuit boards
• CPC Class Codes: H05K 3/4652 : Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y10S 438/977 : Thinning or removal of substrate
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

A component built-in module including a core layer formed of an electric insulating material, and an electric insulating layer and a plurality of wiring patterns, which are formed on at least one surface of the core layer. The electric insulating material of the core layer is formed of a mixture including at least an inorganic filler and a thermosetting resin. At least one or more of active components and/or passive components are contained in an internal portion of the core layer. The core layer has a plurality of wiring patterns and a plurality of inner vias formed of a conductive resin. The electric insulating material formed of the mixture including at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa. Thus, it is possible to provide a thermal conductive component built-in module capable of filling the inorganic filler with high density; burying the active component such as a semiconductor etc. and the passive component such as a chip resistor, a chip capacitor, etc. in the internal portion of the substrate; and simply producing a multilayer wiring structure.

Claims

1. A component built-in module comprising:

a core layer formed of an electric insulating material;

an electric insulating layer formed on at least one surface of the core layer; and

a wiring pattern formed on a surface of the electric insulating layer;

wherein;

the core layer and the electric insulating layer are formed of different electric insulating materials;

the electric insulating material of the core layer is formed of a mixture comprising at least an inorganic filler and a thermosetting resin;

at least one selected from the group consisting of active components and passive components is contained in an internal portion of the core layer;

the core layer has a wiring pattern and an inner via;

the wiring pattern of the core layer is electrically connected to the wiring pattern formed on the electric insulating layer; and

the electric insulating material formed of the mixture comprising at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa.

2. The component built-in module according to claim 1, comprising a through hole that extends through all of the core layer, the electric insulating layer and the wiring pattern.

3. The component built-in module according to claim 1 comprising a core layer formed of an electric insulating material;

an electric insulating layer comprising an electric insulating material formed of a mixture including an inorganic filler and a thermosetting resin, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed of a copper foil;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.

4. The component built-in module according to claim 1, comprising a core layer formed of an electric insulating material;

an electric insulating layer comprising an insulating material formed of a thermosetting resin, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed by copper-plating;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns formed by the copper-plating are connected electrically to each other by the inner via.

5. The component built-in module according to claim 1, comprising a core layer formed of an electric insulating material;

an electric insulating layer formed of an organic film having thermosetting resins on both surfaces, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed of a copper foil;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner visa formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.

6. The component built-in module according to claim 1, comprising a core layer formed of an electric insulating material;

and a ceramic substrate having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer, wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin.

7. The component built-in module according to claim 1, comprising a core layer formed of an electric insulating material;

and a plurality of ceramic substrates having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner visa formed of a conductive resin; and

the plurality of ceramic substrates comprise dielectric materials having different dielectric constants.

8. The component built-in module according to claim 1, wherein a film-shaped passive component is disposed between the wiring patterns formed on at least one surface of the core layer.

9. The component built-in module according to claim 8, where the film-shaped passive component is ax least one selected from the group consisting of a resistor, a capacitor and an inductor formed of a thin film or a mixture comprising an inorganic filler and a thermosetting resin.

10. The component built-in module according to claim 8, where the film-shaped passive component is a solid electrolytic capacitor formed of at least an oxide layer of aluminum or tantalum and a conductive macromolecule.

11. The component built-in module according to claim 1, wherein the component is not built into the electric insulating layer provided on at least one surface of the core layer.

12. The component built-in module according to claim 1, wherein the glass transition temperature of the electric insulating material of the core layer is different from the glass transition temperature of the electric insulating material of the electric insulating layer provided on at least one surface of the core layer.

13. The component built-in module according to claim 1, wherein the wiring pattern of the core layer and the at least one selected from the group consisting of active components and passive components are electrically connected to the wiring pattern formed on the electric insulating layer.

14. The component built-in module according to claim 1, wherein at least two electric insulating layers are formed on the core layer, wiring patterns are formed on the surface of the at least two electric insulating layers, and the wiring pattern of the core layer is electrically connected to the wiring patterns formed on the at least two electric insulating layers.

15. A component built-in module comprising:

core layer formed of an electric insulating material;

an electric insulating layer formed on at least one surface of the core layer; and

a wiring pattern formed on a surface of the electric insulating layer;

wherein;

the core layer and the electric insulating layer are formed of different electric insulating materials;

the electric insulating material of the core layer is formed of a mixture comprising at least an inorganic filler and a thermosetting resin;

at least one selected from the group consisting of active components and passive components is contained in an internal portion of the core layer;

the core layer has a wiring pattern and an inner via;

the wiring pattern of the core layer is electrically connected to the wiring pattern formed on the electric insulating layer;

the electric insulating material formed of the mixture comprising at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa; and

the thermosetting resin comprise a plurality of thermosetting resins having different glass transition temperatures.

16. The component built-in module according to claim 15, comprising a through hole that extends through all of the core layer, the electric insulating layer and the wiring pattern.

17. The component built-in module according to claim 15, comprising a core layer formed of an electric insulating material;

an electric insulating layer comprising an electric insulating material formed of a mixture including an inorganic filler and a thermosetting resin, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed of a copper foil;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias farmed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.

18. The component built-in module according to claim 15, comprising a core layer formed of an electric insulating material;

an electric insulating layer comprising an insulating material formed of a thermosetting resin, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed by copper-plating;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns formed by the copper-plating are connected electrically to each other by the inner vias.

19. The component built-in module according to claim 15, comprising a core layer formed of an electric insulating material;

an electric insulating layer formed of an organic film having thermosetting resins on both surfaces, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed of a copper foil;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.

20. The component built-in module according to claim 15, comprising a core layer formed of an electric insulating material;

and a ceramic substrate having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin.

21. The component built-in module according to claim 15, comprising a core layer formed of an electric insulating material;

and a plurality of ceramic substrates having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin; and

the plurality of ceramic substrates comprise dielectric materials having different dielectric constants.

22. The component built-in module according to claim 15, wherein a film-shaped passive component is disposed between the wiring patterns formed on at least one surface of the core layer.

23. The component built-in module according to claim 15, wherein the component is not built into the electric insulating layer provided on at least one surface of the core layer.

24. The component built-in module according to claim 15, wherein the glass transition temperature of the electric insulating material of the core layer is different from the glass transition temperature of the electric insulating material of the electric insulating layer provided on at least one surface of the core layer.

25. A component built-in module comprising:

a core layer formed of an electric insulating material;

an electric insulating layer formed on at least one surface of the core layer; and

a wiring pattern formed on a surface of the electric insulating layer;

wherein;

the core layer and the electric insulating layer are formed of different electric insulating materials;

the electric insulating material of the core layer is formed of a mixture comprising at least an inorganic filler and a thermosetting resin;

at least one selected from the group consisting of active components and passive components is contained in an internal portion of the core layer;

the core layer has a wiring pattern and an inner via;

the wiring pattern of the core layer is electrically connected to the wiring pattern formed on the electric insulating layer;

the electric insulating material formed of the mixture comprising at least an inorganic filler and a thermosetting resin of the core layer has a modulus of elasticity at room temperature in the range from 0.6 GPa to 10 GPa; and

the thermosetting resin comprises at least a thermosetting resin having a glass transition temperature in the range from −

20°

C. to 60°

C. and a thermosetting resin having a glass transition temperature in the range from 70°

C. to 170°

C.

26. The component built-in module according to claim 25, comprising a through hole that extends through all of the core layer, the electric insulating layer and the wiring pattern.

27. The component built-in module according to claim 25, comprising a core layer formed of an electric insulating material;

an electric insulating layer comprising an electric insulating material formed of a mixture including an inorganic filler and a thermosetting resin, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed of a copper foil;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.

28. The component built-in module according to claim 25, comprising a core layer formed of an electric insulating material;

an electric insulating layer comprising an insulating material formed of a thermosetting resin, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed by copper-plating;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns formed by the copper-plating are connected electrically to each other by the inner vias.

29. The component built-in module according to claim 25, comprising a core layer formed of an electric insulating material;

an electric insulating layer formed of an organic film having thermosetting resins on both surfaces, which is formed on at least one surface of the core layer; and

a plurality of wiring patterns formed of a copper foil;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin, and the wiring patterns are connected electrically to each other by the inner vias.

30. The component built-in module according to claim 25, comprising a core layer formed of an electric insulating material;

and a ceramic substrate having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer;

wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin.

31. The component built-in module according to claim 25, comprising a core layer formed of an electric insulating material;

and a plurality of ceramic substrates having a plurality of wiring patterns and inner vias adhered onto at least one surface of the core layer, wherein the core layer has a plurality of wiring patterns formed of a copper foil and a plurality of inner vias formed of a conductive resin; and

the plurality of ceramic substrates comprise dielectric materials having different dielectric constants.

32. The component built-in module according to claim 25, wherein a film-shaped passive component is disposed between the wiring patterns formed on at least one surface of the core layer.

33. The component built-in module according to claim 25, wherein the component is not built into the electric insulating layer provided on at least one surface of the core layer.

34. The component built-in module according to claim 25, wherein the glass transition temperature of the electric insulating material of the core layer is different from the glass transition temperature of the electric insulating material of the electric insulating layer provided on at least one surface of the core layer.