Non-contact hysteresis measurements of insulating films

• US 6,734,696 B2
• Filed: 11/01/2002
• Issued: 05/11/2004
• Est. Priority Date: 11/01/2001
• Status: Expired due to Term

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Miller, Thomas G., Horner, Gregory S.
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): Nguyen, Jimmy
• Application Number:
  US10/286,358
• Publication Number:
  US 20030117155A1
• Time in Patent Office: 557 Days
• Field of Search: 324/765, 324/754, 324/750, 324/751, 324/752, 324/501, 324/537, 324/753, 324/158.1, 250/492.2, 438/14, 438/17, 438/18
• US Class Current: 324/750.03
• CPC Class Codes: G01N 27/60 by investigating electrostatic variables , e.g. electrographic flaw testing G01N27/007 takes precedence
• CPC Class Codes: G01N 27/61 Investigating the presence of flaws

Abstract

Non-contact methods for determining a property of an insulating film are provided. One method includes measuring an amount of hysteresis in the insulating film without contacting the insulating film. The method also includes determining the amount of hysteresis in the insulating film. Computer-implemented methods for data analysis are also provided. One computer-implemented method includes determining a single numeric value representing an amount of hysteresis in an insulating film from electrical characteristics of the insulating film. The electrical characteristics are measured without contacting the insulating film. In addition, systems that include a measurement system and a computer-usable carrier medium are provided. The measurement system is configured to measure an amount of hysteresis in an insulating film without contacting the insulating film. The carrier medium includes program instructions, which are executable on a computer system for determining the amount of hysteresis in the insulating film using measurements from the measurement system.

Claims

1. A non-contact method for determining a property of an insulating film, comprising:

measuring an amount of hysteresis in the insulating film without contacting the insulating film; and

determining the amount of hysteresis in the insulating film.

2. The method of claim 1, further comprising monitoring a presence of voids in the insulating film using the amount of hysteresis, wherein the amount of hysteresis is responsive to the presence of voids.

3. The method of claim 2, wherein the insulating film comprises a low-k insulating film.

4. The method of claim 2, wherein the insulating film comprises a high-k insulating film.

5. The method of claim 1, further comprising monitoring a presence of traps in the insulating film using the amount of hysteresis, wherein the amount of hysteresis is responsive to the presence of traps.

6. The method of claim 5, wherein the insulating film comprises a thermally grown film.

7. The method of claim 5, wherein the insulating film comprises a high-k insulating film.

8. The method of claim 1, wherein the insulating film comprises a thermally grown film, the method further comprising processing the thermally grown film prior to said measuring, and wherein the amount of hysteresis is responsive to traps in the thermally grown film caused by said processing.

9. The method of claim 1, further comprising processing the insulating film after formation of the insulating film and prior to said measuring, wherein the amount of hysteresis is responsive to damage of the insulating film caused by said processing.

10. The method of claim 9, wherein said processing comprises a plasma process.

11. The method of claim 1, wherein said measuring comprises measuring an electrical characteristic of the insulating film before and after applying an electrical field to the insulating film for a period of time.

12. The method of claim 1, wherein said measuring comprises stressing the insulating film by applying an electrical field to the insulating film, by heating the insulating film, or by applying ultraviolet light to the insulating film.

13. The method of claim 12, wherein said measuring further comprises measuring an electrical characteristic of the insulating film before and after said stressing.

14. The method of claim 1, further comprising measuring one or more other properties of the insulating film and determining the one or more other properties of the insulating film.

15. The method of claim 1, wherein the insulating film comprises an oxide, the method further comprising measuring trace metals in the oxide and determining an amount of the trace metals in the oxide.

16. A computer-implemented method for data analysis, comprising determining a single numeric value representing an amount of hysteresis in an insulating film from electrical characteristics of the insulating film, wherein the electrical characteristics are measured without contacting the insulating film.

17. The method of claim 16, wherein the electrical characteristics of the insulating film are measured before and after application of an electrical field to the insulating film, and wherein the electrical field is applied to the insulating film without contacting the insulating film.

18. The method of claim 16, further comprising analyzing a bulk charge trap density in the insulating film using the single numeric value.

19. The method of claim 16, further comprising analyzing polarization effects of voids in the insulating film using the single numeric value.

20. The method of claim 16, further comprising analyzing damage of the insulating film using the single numeric value, wherein the damage is caused by processing of the insulating film performed after formation of the insulating film.

21. A system, comprising:

a measurement system configured to measure an amount of hysteresis in an insulating film without contacting the insulating film; and

a computer-usable carrier medium comprising program instructions, wherein the program instructions are executable on a computer system for determining the amount of hysteresis in the insulating film using measurements from the measurement system.