Low dielectric constant materials and their production and use
First Claim
1. A silica-based porous film-forming coating solution which includes a solution obtained by dissolving (A1) a compound represented by the general formula R1Si(OR)3 or R1SiX3 (where R1 is a methyl group or phenyl group, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) and (B1) a compound represented by the general formula R2R3Si(OR)2 or R2R3SiX2 (where R2 and R3 each is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, or a methyl group or phenyl group, provided that at least one of R2 and R3 is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) in an organic solvent followed by hydrolysis,wherein the solute in the coating solution has a weight average molecular weight of less than 5.000.
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Abstract
Silica-based low dielectric constant materials having three-dimensional network structures containing siloxane backbones which comprise SiO4 tetrahedron structural units, as well as their production and use. The materials can be applied as interlayer dielectrics for semiconductor elements and the like.
32 Citations
8 Claims
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1. A silica-based porous film-forming coating solution which includes a solution obtained by dissolving (A1) a compound represented by the general formula R1Si(OR)3 or R1SiX3 (where R1 is a methyl group or phenyl group, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) and (B1) a compound represented by the general formula R2R3Si(OR)2 or R2R3SiX2 (where R2 and R3 each is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, or a methyl group or phenyl group, provided that at least one of R2 and R3 is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) in an organic solvent followed by hydrolysis,
wherein the solute in the coating solution has a weight average molecular weight of less than 5.000.
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3. A silica-based porous film-forming coating solution which includes a solution obtained by dissolving (A1) a compound represented by the general formula R1Si(OR)3 or R1SiX3 (where R1is a methyl group or phenyl group, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) and (B1) a compound represented by the general formula R2R3Si(OR)2 or R2R3SiX2 (where R2 and R3 each is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, or a methyl group or phenyl group, provided that at least one of R2 and R3 is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) in an organic solvent followed by hydrolysis,
wherein said coating solution contains a compound represented by the general formula M(OR)n or MXn (where M is at least one metal element selected from the group consisting of B, Al, Ge, Ti, Y, Zr, Nb, Ta and Si, n is the number of equivalences of the metal element, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F), the molar ratio of M to Si is from 0.005 to 0.15, and the molar ratio of alkyl groups and/or phenyl groups to Si is from 0.6 to 1.5.
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5. A process for production of a silica-based porous film which comprises:
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coating a substrate with a silica-based coating solution which includes a solution obtained by dissolving (A1) a compound represented by the general formula R1Si(OR)3 or R1SiX3 (where R1 is a methyl group or phenyl group, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) and (B1) a compound represented by the general formula R2R3Si(OR)2 or R2R3SiX2 (where R2 and R3 each is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, or a methyl group or phenyl group, provided that at least one of R2 and R3 is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F), in an organic solvent followed by hydrolysis, then drying it at a temperature of from 70°
C. to 300°
C., heat treating it at a temperature of from 350°
C. to 650°
C. in an inert gas atmosphere and thermally decomposing the alkyl groups of 2 or more carbon atoms or their fluoro-substituted forms.- View Dependent Claims (6, 7, 8)
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Specification