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Low dielectric constant materials and their production and use

  • US 6,737,118 B2
  • Filed: 04/12/2002
  • Issued: 05/18/2004
  • Est. Priority Date: 05/28/1997
  • Status: Expired due to Fees
First Claim
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1. A silica-based porous film-forming coating solution which includes a solution obtained by dissolving (A1) a compound represented by the general formula R1Si(OR)3 or R1SiX3 (where R1 is a methyl group or phenyl group, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) and (B1) a compound represented by the general formula R2R3Si(OR)2 or R2R3SiX2 (where R2 and R3 each is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, or a methyl group or phenyl group, provided that at least one of R2 and R3 is an alkyl group of 2 or more carbon atoms or a fluoro-substituted form thereof, R is an alkyl group of 1-4 carbon atoms or a phenyl group, and X is a halogen element other than F) in an organic solvent followed by hydrolysis,wherein the solute in the coating solution has a weight average molecular weight of less than 5.000.

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