Distributed circular geometry power amplifier architecture
First Claim
1. A low loss inductor for deposition on a substrate of an integrated circuit that processes voltage signals, comprising:
- an elongated conductive body deposed on the substrate and having first and second ends, conductive sections disposed between the ends, and an average ac signal voltage across the body such that a section where the signal voltage is determined to be lower than the average ac signal voltage across the body is relatively wider than another section of the inductor where the signal voltage is determined to be higher than the average ac signal voltage across the body.
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Abstract
The present invention discloses a distributed power amplifier topology and device that efficiently and economically enhances the power output of an RF signal to be amplified. The power amplifier comprises a plurality of push-pull amplifiers interconnected in a novel circular geometry that preferably function as a first winding of an active transformer having signal inputs of adjacent amplification devices driven with an input signal of equal magnitude and opposite phase. The topology also discloses the use of a secondary winding that matches the geometry of primary winding and variations thereof that serve to efficiently combine the power of the individual power amplifiers. The novel architecture enables the design of low-cost, fully-integrated, high-power amplifiers in the RF, microwave, and millimeter-wave frequencies.
47 Citations
20 Claims
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1. A low loss inductor for deposition on a substrate of an integrated circuit that processes voltage signals, comprising:
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an elongated conductive body deposed on the substrate and having first and second ends, conductive sections disposed between the ends, and an average ac signal voltage across the body such that a section where the signal voltage is determined to be lower than the average ac signal voltage across the body is relatively wider than another section of the inductor where the signal voltage is determined to be higher than the average ac signal voltage across the body. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for reducing the electrical losses of an inductor deposed on a substrate of an integrated circuit, the inductor having an elongated body with interconnected conducting sections, an average width, an average ac signal voltage across the body, the method comprising:
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(a) decreasing the width of a section of the body of the inductor relative to the average width whereat the ac voltage signal on the section is relatively higher than the average ac signal voltage across the inductor body; and
(b) increasing the width of another section of the body of the inductor whereat the ac voltage signal on the other section is relatively lower than the average ac signal voltage across the inductor body. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A low loss inductor for deposition on a substrate of an integrated circuit that processes voltage signals, comprising:
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an elongated conductive body deposed on the substrate and having first and second ends, conductive sections disposed between the ends, and wherein a width of the conductive sections is greater where an average ac signal voltage relative to the substrate is determined to be lower than the average ac signal voltage across the body. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification