Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate

• US 6,739,047 B2
• Filed: 10/30/2002
• Issued: 05/25/2004
• Est. Priority Date: 05/10/2001
• Status: Expired due to Fees

• Current Assignee: Lighting Science Group Corporation (Pegasus Capital Advisors, L.P.)
• Original Assignee: Lamina Ceramics, Inc.
• Inventors: Hozer, Leszek, Frederickson, Gerard, Geller, Bernard Dov, Chen, Hung-tse Daniel, Tormey, Ellen Schwartz, Thaler, Barry Jay, Hammond, Mark Stuart
• Primary Examiner(s): Arbes, Carl J.
• Assistant Examiner(s): Phan, Tim
• Application Number:
  US10/284,544
• Publication Number:
  US 20030062185A1
• Time in Patent Office: 573 Days
• Field of Search: 298/47, 298/51, 298/48, 298/46, 298/31, 298/30, 156/320, 174/52.4, 428/209
• US Class Current: 29/847
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 Multilayer substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base
• CPC Class Codes: Y10T 29/49163 : with sintering of base
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.

Claims

1. A method of forming a high power device module comprising

a) forming a pattern of pad openings completely through the metal support substrate;

b) electroplating said support substrate with nickel;

c) screen printing a patterned conductive solder ink onto both sides of said support substrate;

d) firing said support substrate in nitrogen;

e) oxidizing the nickel layer by heating in air;

f) applying a glazing layer onto the top of said support substrate;

g) mounting a multilayer green tape stack having circuitry on each green tape onto the glazed surface of the support substrate;

h) laminating the green tape stack to the patterned support substrate;

i) filling the openings in the metal support substrate with a high melt temperature dielectric stabilization paste; and

j) firing said module.

2. A method according to claim 1 wherein the dielectric stabilization paste comprises a metal oxide selected from the group consisting of aluminum oxide, zirconium oxide and a mixture of aluminum oxide and zirconium oxide, together with an organic vehicle.

3. A method according to claim 1 wherein an opening is made in the multilayer ceramic stack through to the support substrate.

4. A method according to claim 3 wherein a high power electronic device is mounted in said opening and connected to the multilayer stack circuitry.

5. A method according to claim 4 wherein the circuits on the multilayer stack are connected through to the support substrate with silver.

6. A method according to claim 5 wherein the module is soldered to a motherboard.