Semiconductor package for series-connected diodes
First Claim
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1. A semiconductor device package comprising:
- a first diode having an anode electrode and a cathode electrode and being capable of blocking a reverse current up to a first rated voltage;
a second diode having an anode electrode and a cathode electrode and being capable of blocking the reverse current un to a second rated voltage; and
a common conductive pad;
wherein said cathode electrode of said first diode is electrically connected to said anode electrode of said second diode by said common conductive pad, said anode electrode of said first diode is wire bondable and disposed on a major surface of said first diode occluding substantially all of said major surface of said first diode and said cathode electrode of said first diode is disposed on an opposing major surface of said first diode, and wherein said anode electrode of said second diode is disposed on a major surface of said second diode and said cathode electrode of said second diode is wire bondable and is disposed on an opposing major surface of said second diode occluding substantially all of said opposing major surface of said second diode.
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Abstract
Two series-connected diodes which are housed in a power package (such as but not limited to TO220, TO220FP, D2pak, TO247, etc.).
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Citations
8 Claims
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1. A semiconductor device package comprising:
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a first diode having an anode electrode and a cathode electrode and being capable of blocking a reverse current up to a first rated voltage;
a second diode having an anode electrode and a cathode electrode and being capable of blocking the reverse current un to a second rated voltage; and
a common conductive pad;
wherein said cathode electrode of said first diode is electrically connected to said anode electrode of said second diode by said common conductive pad, said anode electrode of said first diode is wire bondable and disposed on a major surface of said first diode occluding substantially all of said major surface of said first diode and said cathode electrode of said first diode is disposed on an opposing major surface of said first diode, and wherein said anode electrode of said second diode is disposed on a major surface of said second diode and said cathode electrode of said second diode is wire bondable and is disposed on an opposing major surface of said second diode occluding substantially all of said opposing major surface of said second diode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification