Stacked structure for an image sensor

• US 6,740,973 B1
• Filed: 01/09/2003
• Issued: 05/25/2004
• Est. Priority Date: 01/09/2003
• Status: Active Grant

• Current Assignee: Tong Hsing Electronic Industries, Ltd.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Hsin, Chung Hsien
• Primary Examiner(s): Clark, Jasmine
• Application Number:
  US10/340,361
• Time in Patent Office: 502 Days
• Field of Search: 257/684, 257/777, 257/723, 257/685, 257/686, 257/749, 257/778, 257/432
• US Class Current: 257/749
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

An image sensor, which is electrically connected to a printed circuit board. The image sensor includes a transparent glass layer on which signal input terminals and signal output terminals are formed, a photosensitive chip on which bonding pads are formed, a substrate, and an integrated circuit. Each bonding pad is formed with a projection, and the photosensitive chip is electrically connected to the signal input terminals through the projections. The substrate has a first surface, a second surface, and a first through hole penetrating through the substrate from the first surface to the second surface. The signal output terminals are electrically connected to the first surface of the substrate with the photosensitive chip positioned within the first through hole. The second surface is electrically connected to the printed circuit board. The integrated circuit is electrically connected to the second surface of the substrate.

Claims

1. An image sensor to be electrically connected to a printed circuit board, the image sensor comprising:

a transparent glass layer on which a plurality of signal input terminals and signal output terminals are formed;

a photosensitive chip on which a plurality of bonding pads is formed, each of the bonding pads being formed with a projection, and the photosensitive chip being electrically connected to the signal input terminals on the transparent glass layer through the projections;

a substrate having a first surface, a second surface, and a first through hole penetrating through the substrate from the first surface to the second surface, the signal output terminals of the transparent glass layer being electrically connected to the first surface of the substrate with the photosensitive chip positioned within the first through hole of the substrate, and the second surface being electrically connected to the printed circuit board; and

an integrated circuit electrically connected to the second surface of the substrate.

2. The image sensor according to claim 1, wherein the signal output terminals of the transparent glass layer are formed with metallic balls, which are electrically connected to the substrate.

3. The image sensor according to claim 1, wherein the integrated circuit is electrically connected to the second surface of the substrate in a flip chip manner.

4. The image sensor according to claim 1, wherein the integrated circuit is formed into a package body, which is electrically connected to the second surface of the substrate.

5. The image sensor according to claim 1, wherein the integrated circuit is a signal processor.

6. The image sensor according to claim 1, wherein the printed circuit board is formed with a second through hole, and the integrated circuit is located within the second through hole when the substrate is electrically connected to the printed circuit board.