Light emission apparatus and method of fabricating the same

• US 6,741,029 B2
• Filed: 03/28/2002
• Issued: 05/25/2004
• Est. Priority Date: 03/30/2001
• Status: Expired due to Fees

• Current Assignee: ROHM Co., Ltd., Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: ROHM Co., Ltd., Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Takebe, Toshihiko, Maegawa, Mamoru, Matsubara, Hideki, Ishinaga, Hiroki
• Primary Examiner(s): Patel, Nimeshkumar D.
• Assistant Examiner(s): LEURIG, SHARLENE L
• Application Number:
  US10/112,323
• Publication Number:
  US 20020190637A1
• Time in Patent Office: 789 Days
• Field of Search: 313/498, 313/499, 313/503, 313/506, 313/512, 428/690, 428/917, 428/212, 315/169.3
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: Y10T 428/24983 Hardness

Abstract

A light emission apparatus includes: an electrode; a LED mounted on the electrode with an indium layer interposed therebetween, the LED having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal comprising ZnSe serving as a matrix, the epitaxial light emission structure being provided on the substrate and emitting light when an electric current is introduced thereinto; and resin encapsulating the LED, the resin having a glass transition temperature of lower than 80 degrees centigrade or being soft to be still elastic in a vicinity of the LED at room temperature.

Claims

1. A light emission apparatus comprising:

an electrode;

a light emitting device mounted on said electrode with an indium layer interposed therebetween, said light emitting device having a substrate formed of an n-type ZnSe single crystal, and an epitaxial light emission structure formed of a compound crystal comprising ZnSe serving as a matrix thereof, said epitaxial light emission structure being provided on said substrate and emitting light when an electric current is introduced thereinto; and

resin encapsulating said light emitting device, said resin including a first resin that is transparent or that has a light diffusing agent mixed therein, and that covers said light emitting device, and a second resin that is transparent or that has a light diffusing agent mixed therein, and that covers said first resin, said first resin having an elasticity corresponding to an elongation of no less than 40% at room temperature, said second resin being greater in hardness than said first resin.

2. The apparatus of claim 1, wherein said first resin includes a silicone resin and said second resin includes an epoxy resin.

3. The apparatus of claim 1, further comprising a base formed of an insulator, wherein said electrode includes a patterned electrode formed on said base.

4. The apparatus of claim 3, further comprising a reflector provided on said base to surround said light emitting device for reflecting fluorescence received from said substrate, wherein said resin is introduced into a region surrounded by said reflector.

5. A method of fabricating the light emission apparatus of claim 1, comprising the steps of:

mounting the light emitting device the electrode with the indium layer interposed therebetween;

covering said light emitting device with said first resin being a silicone resin; and

transfer-molding said second resin being an epoxy resin to cover said silicone resin therewith.

6. The apparatus of claim 1, wherein said first resin consists of a silicone resin and said second resin consists of an epoxy resin.