Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
First Claim
1. A method of manufacturing a radio frequency transceiver tag, comprising the steps of:
- providing a first sheet and a cover;
affixing directly onto a surface of the first sheet a first electrically conductive strip having a thickness less than 2 mils, wherein the strip is shaped so as to function as a radio frequency antenna;
affixing directly onto said surface of the first sheet a radio frequency transceiver integrated circuit having a thickness no greater than 8 mils, wherein the integrated circuit is positioned so as to overlie and electrically contact a portion of the first conductive strip;
affixing directly onto said surface of the first sheet a second electrically conductive strip having a thickness no greater than 2 mils;
affixing directly onto said surface of the first sheet a battery having a thickness no greater than 10 mils, wherein the battery is positioned so as to overlie and electrically contact a portion of the second conductive strip;
overlaying the cover onto said surface of the first sheet; and
sealing together the cover and the first sheet along a mutual periphery so that the cover and the first sheet together sealingly enclose the integrated circuit;
wherein the integrated circuit is positioned so as to overlie and electrically contact a portion of the second conductive strip so that the second conductive strip electrically connects the battery to the integrated circuit.
4 Assignments
0 Petitions
Accused Products
Abstract
The present application describes an electronically powered postage stamp or mailing label and including a radio frequency identification (RFID) device and system mounted between the opposing and facing major surfaces thereof. The RFID device and system includes an integrated circuit transceiver chip which is connected to and powered by a thin flat battery cell and is operated with a thin film RF antenna, all of which are mounted in side-by-side relationship on a thin base or support layer. These thin flat components are mounted in an essentially two dimensional planar configuration well suited for incorporation into the planar structure of a postage stamp or a mailing label. In addition, the RFID transceiver chip may be replaced with an electro-optically operated IC chip using, for example, LEDs or laser diodes for the propagation of light signals to an interrogator.
168 Citations
6 Claims
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1. A method of manufacturing a radio frequency transceiver tag, comprising the steps of:
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providing a first sheet and a cover;
affixing directly onto a surface of the first sheet a first electrically conductive strip having a thickness less than 2 mils, wherein the strip is shaped so as to function as a radio frequency antenna;
affixing directly onto said surface of the first sheet a radio frequency transceiver integrated circuit having a thickness no greater than 8 mils, wherein the integrated circuit is positioned so as to overlie and electrically contact a portion of the first conductive strip;
affixing directly onto said surface of the first sheet a second electrically conductive strip having a thickness no greater than 2 mils;
affixing directly onto said surface of the first sheet a battery having a thickness no greater than 10 mils, wherein the battery is positioned so as to overlie and electrically contact a portion of the second conductive strip;
overlaying the cover onto said surface of the first sheet; and
sealing together the cover and the first sheet along a mutual periphery so that the cover and the first sheet together sealingly enclose the integrated circuit;
wherein the integrated circuit is positioned so as to overlie and electrically contact a portion of the second conductive strip so that the second conductive strip electrically connects the battery to the integrated circuit. - View Dependent Claims (2, 3)
providing the first sheet and the cover with respective thicknesses no greater than the thickness of the integrated circuit.
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3. A method according to claim 1, wherein the cover is a second sheet.
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4. A method of manufacturing a radio frequency transceiver tag, comprising the steps of:
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providing a first sheet and a cover;
affixing directly onto a surface of the first sheet a first electrically conductive strip, wherein the strip is shaped so as to function as a radio frequency antenna;
affixing directly onto said surface of the first sheet a radio frequency transceiver integrated circuit, wherein the integrated circuit is positioned so as to overlie and electrically contact a portion of the first conductive strip;
affixing a second electrically conductive strip directly onto said surface of the first sheet;
affixing a battery directly onto said surface of the first sheet, wherein the battery is positioned so as to overlie and electrically contact a portion of the second conductive strip;
overlaying the cover onto said surface of the first sheet; and
sealing together the cover and the first sheet along a mutual periphery so that the cover and the first sheet together sealingly enclose the integrated circuit;
wherein the integrated circuit is positioned so as to overlie and electrically contact a portion of the second conductive strip so that the second conductive strip electrically connects the battery to the integrated circuit. - View Dependent Claims (5, 6)
providing the first sheet and the cover with respective thicknesses no greater than the thickness of the integrated circuit.
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6. A method according to claim 4, wherein the cover is a second sheet.
Specification