Method for cutting liquid crystal display panel

• US 6,741,320 B2
• Filed: 09/27/2002
• Issued: 05/25/2004
• Est. Priority Date: 02/20/2002
• Status: Expired due to Term

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Shin, Sang-Sun, Chae, Kyung-Su
• Primary Examiner(s): Dudek, James
• Assistant Examiner(s): Duong, Tai
• Application Number:
  US10/256,100
• Publication Number:
  US 20030155391A1
• Time in Patent Office: 606 Days
• Field of Search: 349/187, 349/1, 349/73, 349/158, 349/155, 349/43, 252/2, 252/103, 438/30
• US Class Current: 349/187
• CPC Class Codes: G02F 1/133351 Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
• CPC Class Codes: Y10T 225/12 With preliminary weakening
• CPC Class Codes: Y10T 225/371 Movable breaking tool

Abstract

A method for cutting a liquid crystal display panel is disclosed in the present invention. The method includes forming a first scribing line on surfaces of first and second mother substrates using first and second wheels, cutting the first and second mother substrates along the first scribing line, forming a second scribing line on the second mother substrate using the second wheel, and removing a dummy region from the second mother substrate by cutting the second mother substrate along the second scribing line.

Claims

1. A method for cutting a liquid crystal display panel, comprising:

forming a first scribing line on surfaces of first and second mother substrates using first and second wheels;

cutting the first and second mother substrates along the first scribing line;

forming a second scribing line on the second mother substrate using the second wheel, the second scribing line on the second mother substrate being formed by vertically aligning the second wheel with a supporting bar supporting the first mother substrate; and

removing a dummy region from the second mother substrate by cutting the second mother substrate along the second scribing line.

2. The method of claim 1, wherein the first and second mother substrates along the first scribing line are cut by applying a pressure to at least a portion of the first scribing line.

3. The method of claim 1, wherein the first and second mother substrates along the first scribing line are cut by applying a pressure along the first scribing line with a roll.

4. The method of claim 1, wherein the first and second mother substrates along the first scribing line are cut by moving first and second tables where the first and second mother substrates are loaded thereon.

5. The method of claim 4, wherein the first and second tables are moved to the opposite directions with each other.

6. The method of claim 1, wherein the first mother substrate including a plurality of thin film transistor array substrates is stacked on the second mother substrate including a plurality of color filter substrates.

7. The method of claim 6, wherein the thin film transistor array substrates are adjacent to each other without separation and overlapping.

8. The method of claim 1, wherein the first and second wheels cut the first and second substrates and are vertically misaligned with each other.

9. A method for cutting a liquid crystal display panel, comprising:

forming a first scribing line on surfaces of first and second mother substrates using first and second wheels;

cutting the first and second mother substrates along the first scribing lines;

forming a second scribing line on the second mother substrate using the second wheel, the second scribing line on the second mother substrate being formed by vertically aligning the second wheel with a roll supporting the first mother substrate; and

removing a dummy region from the second mother substrate by cutting the second mother substrate along the second scribing line.

10. The method of claim 9, wherein the first and second mother substrates along the first scribing line are cut by applying a pressure to at least a portion of the first scribing line.

11. The method of claim 9, wherein the first and second mother substrates along the first scribing line are cut by applying a pressure along the first scribing line with a roll.

12. The method of claim 9, wherein the first and second mother substrates along the first scribing line are cut by moving first and second tables where the first and second mother substrates are loaded thereon.

13. The method of claim 12, wherein the first and second tables are moved to the opposite directions with each other.

14. The method of claim 9, wherein the first mother substrate including a plurality of thin film transistor array substrates is stacked on the second mother substrates including a plurality of color filter substrates.

15. The method of claim 9, wherein the thin film transistor array substrates are adjacent to each other without separation and overlapping.

16. The method of claim 9, wherein the first and second wheels cut the first and second substrates and are vertically misaligned with each other.