Adhesiveless transfer lamination method and materials for producing electronic circuits

• US 6,743,319 B2
• Filed: 10/04/2002
• Issued: 06/01/2004
• Est. Priority Date: 09/30/1998
• Status: Expired due to Fees

• Current Assignee: Parelec Incorporated
• Original Assignee: Paralec Incorporated
• Inventors: Kydd, Paul H.
• Primary Examiner(s): LORENGO, JERRY A
• Application Number:
  US10/265,513
• Publication Number:
  US 20030070747A1
• Time in Patent Office: 606 Days
• Field of Search: 156/230, 156/231, 156/233, 156/238, 156/240, 156/241, 156/242, 156/247, 156/277, 156/289, 156/272.2, 156/273.3, 428/195, 428/200, 428/201, 428/262, 428/204, 428/208, 428/209, 428/211, 428/914, 428/915, 428/202, 427/146, 427/147, 427/148, 427/96, 174/250, 174/256, 174/257
• US Class Current: 156/230
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/016 Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/121 Metallo-organic compounds
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: Y10S 428/914 Transfer or decalcomania
• CPC Class Codes: Y10T 428/24851 Intermediate layer is discontinuous or differential
• CPC Class Codes: Y10T 428/2486 with outer strippable or release layer
• CPC Class Codes: Y10T 428/24909 Free metal or mineral containing

Abstract

An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.

Claims

1. A method for producing one or more patterned metal objects on a substrate comprising the steps of:

a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;

b) curing said metal composition at a temperature below about 450°

C. for a time less than about 30 minutes to form the one or more patterned metal objects;

c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate without the use of a separately supplied adhesive

wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.

2. The method of claim 1 wherein in transferring step c) said one or more patterned metal objects are directly transferred to said substrate by the application of heat and pressure.

3. The method of claim 2, wherein said substrate is a cured substrate.

4. The method of claim 1 wherein said transferring step c) comprises placing one or more layers of a substrate precursor in contact with said one or more patterned metal objects on said temporary substrate and then curing said substrate precursor in place to form the substrate having said one or more patterned metal objects incorporated therein.

5. The method of claim 1 further comprising the steps of:

d) applying a metal composition on a second thermally resistant substrate in the patterns of additional one or more patterned metal objects;

e) curing said metal composition at a temperature below about 450°

C. for a time less than about 30 minutes to form said additional one or more patterned metal objects;

f) Transferring said additional one or more patterned metal objects from said second temporary substrate to the side of the substrate opposite to which said one or more patterned metal objects were transferred in step c).

6. The method of claim 1 wherein said metal composition is applied to said temporary substrate using a method selected from the group consisting of screen printing, stenciling, dispensing, gravure printing, ink jet printing, impression printing, offset printing and electrostatic printing.

7. The method of claim 1, wherein said temporary substrate is in the form of a continuous belt.

8. The method of claim 1 wherein said temporary substrate is selected from the group consisting of polyimide films, polysulfone films, polyester films, Teflon-coated films, silicone-coated films, Teflon-glass laminates, Polyimide-glass laminates, Aramid fiber laminates, metal foils and sheets, glass plates and ceramic bodies.

9. The method of claim 1 wherein substrate is selected from the group consisting of polyethylene, polypropylene, polystyrene, polyester, polycarbonate, polyurethane, polyimide, cellulose, paper, cardboard, epoxy laminates, polyester laminates and polyimide laminates.

10. The method of claim 1 wherein the substrate is in the form of a tape or continuous web.

11. The method of claim 1 wherein said metal composition is comprised of metal particles and a reactive organic medium, wherein said reactive organic medium is comprised of a decomposable compound or one or more reagents which form a decomposable compound with said metal particles.

12. The method of claim 11 wherein said decomposable compound in the reactive organic medium has a weak heteroatom bond to the metal such that it will decompose at a temperature which said temporary substrate can withstand.

13. The method of claim 12 wherein said heteroatom is selected from the group consisting of O, N, S, P, and As.

14. The method of claim 11 in which said metal particles are selected from the group consisting of the group IB, IIB, IVA, VA, VI A, VII A and VIIIA metals, manganese, indium, tin, antimony, lead and bismuth.

15. A method for producing one or more patterned metal objects on a substrate comprising the steps of:

a) applying a metal composition on a thermally resistant temporary substrate in the patterns of the one or more patterned metal objects;

b) curing said metal composition at a temperature below about 450°

C. for a time less than about 30 minutes to form the one or more patterned metal objects;

c) transferring the one or more patterned metal objects from said temporary substrate to one side of the substrate without the use of a separately supplied adhesive;

d) applying a metal composition on a second thermally resistant substrate in the patterns of additional one or more patterned metal objects;

g) curing said metal composition at a temperature below about 450°

C. for a time less than about 30 minutes to form said additional one or more patterned metal objects;

h) transferring said additional one or more patterned metal objects from said second temporary substrate to the side of the substrate opposite to which said one or more patterned metal objects were transferred in step c);

wherein step f) comprises placing a previously made double sided circuit and an additional substrate over said one or more patterned objects and then transferring said additional one or more patterned metal objects from said second temporary substrate to said substrate and previously made circuit to produce multiple layers;

wherein said metal composition is comprised of one or more metal powders in a reactive organic medium, said reactive organic medium consisting of one or more components selected from the group consisting of metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, reagents which can react with said one or more metal powders to form metallo-organic compounds which can decompose into elemental metal and volatile organic fragments, and mixtures thereof.