Testing circuit and method for MEMS sensor packaged with an integrated circuit

• US 6,744,264 B2
• Filed: 04/25/2002
• Issued: 06/01/2004
• Est. Priority Date: 04/25/2002
• Status: Expired due to Term

• Current Assignee: North Star Innovations Inc. (Wi-LAN Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Jo, Sung Jin, Gogoi, Bishnu P.
• Primary Examiner(s): Le, N.
• Assistant Examiner(s): Nguyen, Vincent Q.
• Application Number:
  US10/133,701
• Publication Number:
  US 20030201777A1
• Time in Patent Office: 768 Days
• Field of Search: 324/658, 324/661, 324/663, 324/665, 324/666, 324/676, 324/680, 324/686, 735/141.8, 738/626.26, 738/626.1, 737/18, 737/24, 737/54, 361/280, 361/283.3
• US Class Current: 324/658
• CPC Class Codes: G01D 21/00 Measuring or testing not otherwise provided for
• CPC Class Codes: G01D 5/2405 by varying dielectric
• CPC Class Codes: G01R 31/2829 Testing of circuits in sensor or actuator systems testing of apparatus for measuring electric or magnetic variables G01R35/00; testing of indicating or recording apparatus G01D; in airbag systems B60R21/0173; checking gas analysers G01N33/007; monitoring or fail-safe circuits for electromagnets H01F7/1844

Abstract

A MEMS sensor packaged with an integrated circuit includes switches and control circuitry. In a test mode, the control circuitry causes the switches to turn off and on such that the first and second capacitance of the MEMS sensor can be monitored individually. During a normal mode of operation, the switches are maintained such that the MEMS sensor packaged with the integrated circuit operates to produce a filtered and trimmed output reflecting the sensed phenomena.

Claims

1. A packaged device comprising:

a micro-electromechanical systems (MEMS) sensor comprising a moving element connected to a first output, a first plate connected to a second output and a second plate connected to a third output, wherein the moving element and the first plate form a first capacitor producing a first capacitance and the moving element and the second plate form a second capacitor producing a second capacitance;

an amplifier with a first input connected to the first output, a second input connected to a first voltage of a plurality of voltages and a fourth output accessible outside the integrated circuit;

a testing means for causing an output voltage appearing at the fourth output to reflect one of the first and the second capacitances, wherein the testing means comprises a first switch preventing any voltage from being applied to the second output in an open state.

2. The packaged device of claim 1 further comprising a reference capacitor connected between the first input and the fourth output.

3. The packaged device of claim 1 wherein the testing means further comprises a second switch preventing any voltage from being applied to the third output in an open state.

4. The packaged device of claim 3 further comprising a third switch for discharging the reference capacitor in a closed state.

5. The packaged device of claim 4, wherein the testing means comprises a control logic for determining in what sequence to discharge the reference capacitor by closing the third switch, open the first switch and step the first voltage applied to the third output to a second voltage of the plurality of voltages.

6. The packaged device of claim 1 further comprising a control logic means for applying one of the plurality of voltages.

7. The packaged device of claim 4, further comprising a signal conditioning circuitry connected to the fourth output and producing a fifth output with a conditioned signal.

8. The packaged device of claim 4 further comprising a means for applying the plurality of voltages, the means for applying the plurality of voltages including a control logic for sequentially doing one of either opening the first switch while keeping the second switch closed and toggling the voltage applied to the third output from the first voltage to a second voltage of the plurality of voltages or opening the second switch while keeping the first switch closed and toggling the voltage applied to the second output from the first voltage to a third voltage of the plurality of voltages.

9. The packaged device of claim 7 further comprising a fourth switch and a fifth switch allowing the fourth output to bypass the signal conditioning circuitry when the fourth switch is in a closed state and the fifth switch is in an open state.

10. The packaged device of claim 9 wherein the testing means includes a control logic for sequentially doing one of either opening the first switch while keeping the second switch closed and toggling the voltage applied to the third output from the first voltage to a second voltage of the plurality of voltages or opening the second switch while keeping the first switch closed and toggling the voltage applied to the second output from the first voltage to a third voltage of the plurality of voltages.

11. The packaged device of claim 10 wherein the testing means further includes control logic for causing the fourth output to appear at the fifth output by bypassing the signal conditioning circuitry.

12. A packaged device comprising:

a micro-electromechanical systems (MEMS) sensor comprising a moving element connected to a first output, a first plate connected to a second output and a second plate connected to a third output, wherein the moving element and the first plate form a first capacitor producing a first capacitance and the moving element and the second plate form a second capacitor producing a second capacitance;

an amplifier with a first input connected to the first output, a second input connected to a first voltage of a plurality of voltages and a fourth output accessible outside the integrated circuit;

a reference capacitor connected between the first input and the fourth output;

a control logic providing a plurality of control signals;

a first switch connected between the second output and the control logic, wherein the switch is enabled or disabled by a first control signal of the plurality of control signals;

a second switch connected between the third output and the control logic, wherein the second switch is enabled or disabled by a second control signal of the plurality of control signals; and

a third switch connected between the first input and the fourth output, wherein the third switch is enabled or disabled by a third control signal of the plurality of control signals.

13. The packaged device of claim 12 further comprising a signal conditioning circuitry having a fifth output connected between the fourth output and an output pin.

14. The packaged device of claim 13 further comprising a fourth switch connected between the fourth output and the output pin and a fifth switch connected between the fifth output and the output pin, wherein the fourth switch and the fifth switch are enabled by a fourth control signal and a fifth control signal, respectively.

15. A method for testing individual characteristics of a first capacitance and a second capacitance of a micro-electromechanical systems (MEMS) sensor packaged with an integrated circuit comprising:

disabling one of either the first capacitance and the second capacitance;

causing a common node of the first and second capacitance to appear on a first input of an amplifier;

causing a reference voltage to appear on a second input of the amplifier;

discharging a reference capacitor connected between the first input and an output of the amplifier;

after discharging the reference capacitor causing a voltage applied to the other of either the first capacitance and the second capacitance to change from the reference voltage to an excitation voltage;

measuring a characteristic representative of the other of either the first capacitance and the second capacitance appearing on the output; and

intermittently discharging the reference capacitor and causing the voltage applied to the other of the first capacitance and second capacitance to step between the reference voltage and the excitation voltage.