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Board-level EMI shield with enhanced thermal dissipation

  • US 6,744,640 B2
  • Filed: 04/10/2002
  • Issued: 06/01/2004
  • Est. Priority Date: 04/10/2002
  • Status: Expired due to Term
First Claim
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1. An apparatus comprising:

  • (a) a substrate having at least one electrical component disposed thereon;

    (b) a plurality of discrete electrically conductive fastening units disposed in a pattern on said substrate surrounding said at least one electrical component;

    (c) a board-level electromagnetic interference (EMI) shield comprising an electrically conductive layer;

    (d) a plurality of apertures formed in said board-level EMI shield such that said apertures correspond to said pattern of said electrically conductive fastening units;

    (e) at least one thermally conductive interface (TCI) material disposed over said at least one electrical component; and

    (f) wherein said electrically conductive layer of said board-level EMI shield is in electrical contact with at least one said electrically conductive fastening units.

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