Maintenance method and system for plasma processing apparatus etching and apparatus

• US 6,745,096 B2
• Filed: 09/06/2001
• Issued: 06/01/2004
• Est. Priority Date: 07/26/2001
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Tanaka, Junichi, Ikuhara, Shoji, Yamamoto, Hideyuki, Masuda, Toshio, Kagoshima, Akira
• Primary Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US09/946,621
• Publication Number:
  US 20030019839A1
• Time in Patent Office: 999 Days
• Field of Search: 700/29, 700/90, 700/121, 700/110, 700/108-109, 702/185, 702/183, 428/5, 428/800
• US Class Current: 700/121
• CPC Class Codes: H01J 37/32862 In situ cleaning of vessels and/or internal parts
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

For maintenance after wet cleaning of a plasma processing apparatus which processes a specimen in a vacuum processing chamber by using a plasma, when restoration processing after the wet cleaning of members configuring the vacuum processing chamber is performed with the vacuum processing chamber opened to the atmosphere, it is automatically or semiautomatically judged whether the restoration processing is appropriate or not according to a predetermined optimum sequence inherent in the apparatus, and the next processing is started automatically or semiautomatically according to the results.

Claims

1. A maintenance system for a plasma processing apparatus, which is provided with a vacuum processing chamber, a vacuum evacuation section, a plasma generating gas supply section, a plasma generating section, and a specimen stage on which a wafer to be processed in the vacuum processing chamber is placed, comprising:

an operation circuit for performing a sequence for a restoring operation after maintenance as to each of a plurality of inspected items;

a storage section for storing measured data;

a plurality of detection sensors for collecting measured data values from the plasma processing apparatus during a restoring operation;

an I/O section for setting criteria; and

a comparison/decision circuit for comparing the set criteria with the measured data values obtained during the restoring operation and stored in the storage section as to each of the plurality of inspected items, wherein

the operation circuit determines, when the measured data values obtained during the restoring operation as to at least one of the plurality of inspected items is within given criteria, that the restoring operation of the at least one of the plurality of inspected items is appropriate, to thereby perform the restoring operation of another one of the plurality of inspected items.

2. The maintenance system according to claim 1, wherein an emission spectrometer is provided as said detection sensors to measure a plasma emission intensity having a single or plurality of wavelengths.

3. The maintenance system according to claim 1, wherein a mass gas analyzer for detecting molecules or atoms of an arbitrary mass is provided as said detection sensors.

4. The maintenance system according to claim 1, wherein a foreign substance detection device is incorporated as said detection sensors.

5. The maintenance system according to claim 1, wherein a thickness measuring device which detects a thickness by measuring interference light from the surface of a wafer when external light or light which is generated by the plasma itself is irradiated to the wafer surface is incorporated as said detection sensors.

6. The maintenance system according to claim 1, wherein a detector for measuring at least one of a high-frequency output voltage, a current, a phase and a reflected wave power is incorporated as said detection sensors.

7. The maintenance system according to claim 1, wherein the comparing operation performed between the set criterion and the measured data values during the restoring operation as to one of the plurality of the inspected items performed by the comparison/decision circuit is arranged in a manner that the comparing operation is performed by plural steps, and allowances of the set criterion used in the comparing operations is determined to become narrower as the comparing steps proceed.

8. The maintenance system according to claim 1, wherein the sequence for the restoring operation performed by the operation circuit is a restoring sequence to restart after a wet cleaning operation.

9. A system for a plasma processing apparatus, comprising:

a plurality of detection sensors for collecting measured data values from the plasma processing apparatus; and

a comparison/decision circuit for comparing set criteria with the measured data values as to each of the plurality of inspected items, wherein

an operation circuit determines, when the measured data values obtained during a restoring operation as to at least one of the plurality of inspected items is within given criteria, that the restoring operation of the at least one of the plurality of inspected items is appropriate, to thereby perform the restoring operation of another one of the plurality of inspected items.

10. The system for a plasma processing apparatus according to claim 9, wherein the comparing operation performed between the set criterion and the measured data values during the restoring operation as to one of the plurality of the inspected items performed by the comparison/decision circuit is arranged in a manner that the comparing operation is performed by plural steps, and allowances of the set criterion used in the comparing operations is determined to become narrower as the comparing steps proceed.

11. The maintenance system according to claim 9, wherein the sequence for the restoring operation performed by the operation circuit is a restoring sequence to restart after a wet cleaning operation.