Apparatus for and method of cleaning objects to be processed

• US 6,746,543 B2
• Filed: 12/13/2001
• Issued: 06/08/2004
• Est. Priority Date: 09/27/1996
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Nakashima, Satoshi, Kamikawa, Yuji, Ueno, Kinya
• Primary Examiner(s): EL ARINI, ZEINAB
• Application Number:
  US10/013,550
• Publication Number:
  US 20030159718A1
• Time in Patent Office: 908 Days
• Field of Search: 134/2, 134/3, 134/15, 134/21, 134/25.1, 134/25.4, 134/25.5, 134/26, 134/28, 134/30, 134/32, 134/34, 134/36, 134/37, 134/40, 134/41, 134/61, 134/66, 134/105, 134/107, 134/102.3, 134/200, 134/95.2, 134/902
• US Class Current: 134/26
• CPC Class Codes: B08B 3/08 the liquid having chemical or dissolving effect substances used, see the relevant classes
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Claims

1. A cleaning method of cleaning an object to be processed using a cleaning apparatus including

a cleaning bath for storing cleaning liquid in which said object is immersed, said cleaning bath having an upper portion located in an upper part of said cleaning bath, the upper portion defining an upper opening;

a drying chamber for drying the object, said drying chamber being enclosed by a case arranged above said cleaning bath, said case having a lower portion located in a lower part of the drying chamber, the lower portion defining a lower opening, said lower opening being in position to and being connected with said upper opening of said cleaning bath between said case of said drying chamber and said cleaning bath; and

a transporter extendable from the outside of the cleaning apparatus through said lower opening and said upper opening for transporting said object, said cleaning method comprising the steps of;

(a) transporting said object from said drying chamber into said cleaning bath through said lower opening by retaining said object by said transporter;

(b) storing cleaning liquid in said cleaning bath before or after transporting said object from said drying chamber into said cleaning bath and subsequently immersing to clean said object in said cleaning liquid stored in said cleaning bath, said immersing step having a step of cleaning said object in deionized water, the temperature of which is lower than room temperature, at least at the last part of the immersing step;

(c) transporting said object cleaned by deionized water, the temperature of which is lower than room temperature, from said cleaning bath into said drying chamber; and

(d) drying said object by an atmosphere of organic solvent in said drying chamber.

2. The cleaning method as claimed in claim 1, further comprising the steps of closing said lower opening, after the step (c) and before step (d).

3. The cleaning method as claimed in claim 1, wherein in the steps of closing said lower opening, said lower opening is closed to seal up said drying chamber.

4. The cleaning method as claimed in claim 1, further comprising a step of filling up said drying chamber with inert gas after said object has been transported from an outside of said cleaning apparatus into said drying chamber, said step preceding step (b).

5. The cleaning method as claimed in claim 1, wherein a gas that includes organic solvent is supplied into said drying chamber before the step (c).

6. The cleaning method as claimed in claim 1, wherein a gas that includes organic solvent is supplied into said drying chamber before and during the step (c).

7. The cleaning method as claimed in claim 1, wherein the temperature of said deionized water is around 5°

C.