High-k dielectric bird's beak optimizations using in-situ O2 plasma oxidation
First Claim
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1. A method of forming a semiconductor integrated circuit, the method comprising:
- forming a dielectric layer on a substrate;
forming a gate conductive layer on the dielectric layer;
patterning and etching the gate conductive layer to form a gate electrode;
oxidizing the gate electrode using plasma oxidation to form a sidewall oxide;
etching the dielectric layer selectively such that a first region of the dielectric layer directly under the sidewall oxide is not etched; and
removing the sidewall oxide after etching the dielectric layer.
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Abstract
In a method of forming an integrated circuit device, sidewall oxides are formed by plasma oxidation on the patterned gate. This controls encroachment beneath a dielectric layer underlying the patterned gate. The patterned gate is oxidized using in-situ O2 plasma oxidation. The presence of the sidewall oxides minimizes encroachment under the gate edge.
40 Citations
19 Claims
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1. A method of forming a semiconductor integrated circuit, the method comprising:
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forming a dielectric layer on a substrate;
forming a gate conductive layer on the dielectric layer;
patterning and etching the gate conductive layer to form a gate electrode;
oxidizing the gate electrode using plasma oxidation to form a sidewall oxide;
etching the dielectric layer selectively such that a first region of the dielectric layer directly under the sidewall oxide is not etched; and
removing the sidewall oxide after etching the dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of forming a semiconductor integrated circuit, the method comprising:
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forming a high-k dielectric layer on a substrate;
defining a gate electrode on the high-k dielectric layer;
forming a sidewall oxide on the gate electrode, the thickness of the sidewall oxide selected to correspond to an expected lateral penetration distance for SiO2 bird'"'"'s beak encroachment under the high-k dielectric layer;
etching the high-k dielectric layer selectively such that a first region of the high-k dielectric layer directly under the sidewall oxide is not etched; and
removing the sidewall oxide after etching the high-k dielectric layer.
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Specification