Flip chip package structure

• US 6,747,350 B1
• Filed: 06/06/2003
• Issued: 06/08/2004
• Est. Priority Date: 06/06/2003
• Status: Expired due to Term

• Current Assignee: Intellectual Ventures Assets 174 LLC (Intellectual Ventures LLC)
• Original Assignee: Silicon Integrated Systems Corporation (Silicon Integrated Systems Corporation Taiwan)
• Inventors: Hsueh, Yin-Chieh, Wu, Chung-Ju, Lin, Wei-Feng
• Primary Examiner(s): CLARK, SHEILA V
• Application Number:
  US10/455,525
• Time in Patent Office: 368 Days
• Field of Search: 257/704, 257/706, 257/707, 257/783, 257/778, 257/787
• US Class Current: 257/704
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/166 Material
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A flip chip package structure. The structure includes a substrate, an IC chip electrically connected to the substrate through a plurality of conductive bumps, encapsulant between the substrate and IC chip, and an electrically protective device. The substrate has interior wiring, a plurality of first contacts arranged at a predetermined pitch among each other on a surface, and a trace line area beyond the first contacts on the surface. The electrically protective device has a protruding part covering the IC chip, and an extending part extending over the surface of the substrate with a gap as large as 40 mil. The extending part further covers the trace line area, and connects to the surface of the substrate using a fixing material.

Claims

1. A flip chip package structure, comprising:

a substrate having an interior wiring, a plurality of first contacts arranged at a predetermined pitch among each other on a surface, and a trace line area on the surface, beyond the first contacts;

an IC chip overlying the surface of the substrate, the IC chip electrically connected to the substrate with a plurality of conductive bumps arranged at the predetermined pitch among each other between the IC chip and first contacts;

an encapsulant between the substrate and IC chip, the encapsulant further filling the pitches among the conductive bumps; and

an electrically protective device having a protruding part and extending part, the protruding part covering the IC chip, the extending part extending over the surface of the substrate with a gap between the extending part and the surface of the substrate not exceeding approximately 40 mil, the extending part further covering the trace line area and connected to the surface of the substrate with a fixing material so as to fasten the electrically protective device to the substrate.

2. The structure as claimed in claim 1, wherein the protruding part further connects to the IC chip by the fixing material.

3. The structure as claimed in claim 1, wherein the electrically protective device is Al or Cu.

4. The structure as claimed in claim 1, wherein the substrate further comprises a plurality of second contacts on the surface and the extending part further comprises a plurality of third contacts respectively connected to the second contacts so as to fasten the electrically protective device to the substrate.

5. The structure as claimed in claim 4, wherein the substrate further comprises a grounding device.

6. The structure as claimed in claim 5, wherein the second contacts further electrically connect to the grounding device using the interior wiring.

7. The structure as claimed in claim 1, wherein the fixing material is electrically conductive material.

8. The structure as claimed in claim 2, wherein the fixing material is both electrically and thermally conductive material.

9. The structure as claimed in claim 1, wherein the fixing material is a mixture of silver powders and epoxy resins.

10. The structure as claimed in claim 1, further comprising the extending part conformally extending over the surface of the substrate.