Optical interference type panel and the manufacturing method thereof
First Claim
1. A manufacturing method for optical interference type panel, comprising:
- forming a patterned supporting layer on a transparent substrate;
forming a first electrode layer on the transparent substrate and the supporting layer;
forming an optical film on the first electrode layer;
forming a sacrificial layer on the optical film between the adjacent supporting layers;
forming a second electrode layer on the sacrificial layer between the adjacent supporting layers and the portion of the optical layer; and
removing the sacrificial layer.
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Abstract
A manufacturing method for optical interference type panel is provided. A patterned supporting layer is formed on a transparent substrate, and then a first electrode layer and an optical film are formed sequentially on the supporting layer and the transparent substrate. A sacrificial material layer is formed on the optical layer, and then, a backside exposure process is performed by using the supporting layer as a mask to pattern the sacrificial material layer. A portion of the patterned sacrificial material layer is removed to expose the optical film above the supporting layer to form a sacrificial layer, and then a second electrode layer is formed on the sacrificial layer between the adjacent supporting layers and portion of the optical film. Afterwards, the sacrificial layer is removed.
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Citations
20 Claims
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1. A manufacturing method for optical interference type panel, comprising:
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forming a patterned supporting layer on a transparent substrate;
forming a first electrode layer on the transparent substrate and the supporting layer;
forming an optical film on the first electrode layer;
forming a sacrificial layer on the optical film between the adjacent supporting layers;
forming a second electrode layer on the sacrificial layer between the adjacent supporting layers and the portion of the optical layer; and
removing the sacrificial layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
forming a sacrificial material layer on the optical film; and
removing a portion of the sacrificial material layer to expose the optical film above the supporting layer so as to form the sacrificial layer, wherein the sacrificial layer is below the optical layer above the supporting layer.
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11. The manufacturing method for optical interference type panel of claim 10, wherein an etching method is used to remove the sacrificial material layer to expose the optical film above the supporting layer so as to form the sacrificial layer.
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12. The manufacturing method for optical interference type panel of claim 11, wherein after a sacrificial material layer is formed on the optical film, and before the portion of the sacrificial material layer is removed to expose the optical film above the supporting layer so as to form the sacrificial layer, further comprises a backside exposure process to pattern the sacrificial material layer.
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13. The manufacturing method for optical interference type panel of claim 1, wherein the second electrode layer is made of a metal material.
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14. The manufacturing method for optical interference type panel of claim 1, wherein the method for removing the sacrificial layer comprises a release process.
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15. An optical interference type panel, comprising:
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a transparent substrate;
a supporting layer, located on the transparent substrate;
a first electrode, located on the transparent substrate and the supporting layers;
an optical film, located on the first electrode; and
a second electrode, wherein an edge of the second electrode is located on the portion of the optical film above the adjacent supporting layer. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification