Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate
First Claim
1. An electrical switching assembly comprising:
- a first non-conductive substrate having a surface;
a layer of dielectric material deposited upon the surface of the first non-conductive substrate and patterned to create heater cavities, a liquid metal channel and passages connecting the heater cavities to locations along the liquid metal channel;
a second non-conductive substrate having a surface;
a layer of adhesive deposited on the surface of the second non-conductive substrate and patterned to match the pattern of the layer of dielectric material; and
the surfaces of the first and second non-conducting substrates facing each other and being brought into contact through the intervening layer of dielectric material and the layer of adhesive.
1 Assignment
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Accused Products
Abstract
Channels and cavities in a LIMMS device are formed from a layer of thick film dielectric material deposited on a substrate, which layer is then covered with a thin cover plate of ceramic or perhaps glass. The layer of dielectric material may be patterned using established thick film techniques, and good dimensional control can be achieved. The dielectric layer is itself its own hermetic seal against the substrate, and readily lends itself to the formation of the additional hermetic seal needed between itself and the cover plate. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.
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Citations
8 Claims
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1. An electrical switching assembly comprising:
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a first non-conductive substrate having a surface;
a layer of dielectric material deposited upon the surface of the first non-conductive substrate and patterned to create heater cavities, a liquid metal channel and passages connecting the heater cavities to locations along the liquid metal channel;
a second non-conductive substrate having a surface;
a layer of adhesive deposited on the surface of the second non-conductive substrate and patterned to match the pattern of the layer of dielectric material; and
the surfaces of the first and second non-conducting substrates facing each other and being brought into contact through the intervening layer of dielectric material and the layer of adhesive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification