Printed circuit board employing lossy power distribution network to reduce power plane resonances

• US 6,753,481 B2
• Filed: 08/23/2002
• Issued: 06/22/2004
• Est. Priority Date: 11/23/1999
• Status: Expired due to Term

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Novak, Istvan
• Primary Examiner(s): Pert, Evan
• Assistant Examiner(s): PATEL, ISHWARBHAI B
• Application Number:
  US10/227,139
• Publication Number:
  US 20030015344A1
• Time in Patent Office: 669 Days
• Field of Search: 174/255, 174/260, 174/262, 174/261, 174/253, 361/760, 361/792, 361/793, 361/794, 361/795, 361/780
• US Class Current: 174/255
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes

Abstract

An interconnecting apparatus employing a lossy power distribution network to reduce power plane resonances. In one embodiment, a printed circuit board includes a lossy power distribution network formed by a pair of parallel planar conductors separated by a dielectric layer.

Claims

1. A printed circuit board comprising:

a first conductive layer forming a first power supply plane;

a second conductive layer forming a second power supply plane;

a first dielectric layer adjacent to and separating the first and second conductive layers;

a second dielectric layer adjacent to said second conductive layer;

a third conductive layer forming a third power supply plane, wherein the third conductive layer is adjacent to said second dielectric layer;

a fourth conductive layer forming a fourth power supply plane;

a third dielectric layer adjacent to and separating the third and fourth conductive layers;

wherein at least one of the first, second, third, or fourth conductive layers includes one or more uniform patterns, wherein each of the one or more uniform patterns includes a plurality of slots, wherein the slots comprise a removed portion of conductive material, and wherein the slots are arranged such that a bridge of conductive material exists between them.

2. The printed circuit board as recited in claim 1 wherein the first dielectric layer has a thickness of no more than 0.5 mils.

3. The printed circuit board as recited in claim 2 wherein the first conductive layer has a thickness of no more than 0.5 mils.

4. The printed circuit board as recited in claim 3 wherein the second conductive layer, the second dielectric layer, the third conductive layer, the fourth conductive layer, and the third dielectric layer each have a thickness of no more than 0.5 mils.

5. The printed circuit board as recited in claim 1 wherein the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, the first dielectric layer, the second dielectric layer, and the third dielectric layer each have a thickness of no more than 0.2 mils.

6. The printed circuit board as recited in claim 1 further comprising a via which electrically interconnects the first conductive layer and the third conductive layer.

7. The printed circuit board as recited in claim 6 further comprising a second via which electrically interconnects the second conductive layer and the fourth conductive layer.

8. The printed circuit board as recited in claim 1, wherein the first dielectric layer has a loss tangent value of at least 0.2 for frequencies at or above a lowest resonance frequency of the first and second power supply planes.