Inspection system and inspection process for wafer with circuit using charged-particle beam

• US 6,753,524 B2
• Filed: 06/12/2002
• Issued: 06/22/2004
• Est. Priority Date: 11/19/2001
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Nozoe, Mari, Matsui, Miyako
• Primary Examiner(s): Lee, John R.
• Assistant Examiner(s): Hashmi, Zia R.
• Application Number:
  US10/166,774
• Publication Number:
  US 20030094572A1
• Time in Patent Office: 741 Days
• Field of Search: 250/310, 250/311, 250/548, 324/751, 356/394, 356/237.1
• US Class Current: 850/9
• CPC Class Codes: H01J 2237/0047 using electromagnetic radiations, e.g. UV, X-rays, light
• CPC Class Codes: H01J 2237/2817 Pattern inspection
• CPC Class Codes: H01J 37/28 with scanning beams H01J37/268, H01J37/292, H01J37/2955 take precedence

Abstract

In a method for inspecting positions and types of defects on wafers with circuit patterns in a semiconductor manufacturing process, inspection is made regardless of the types and materials of junctions of circuit patterns of the semiconductor devices, different kinds of defects being distinguished from one another. Further, electrification of the circuit pattern is prevented, and the area to be exposed to an electron beam is controlled evenly and at a desired voltage. During inspection of the positions and types of defects on a wafer using a charged-particle beam from a charged-particle source, an optical beam from an optical source as well as a charged-particle beam are applied to a junction of the circuit pattern of the wafer placed on a wafer holder. Thus, regardless of the types and materials of circuit patterns, a highly sensitive inspection is made according to contrasts in the defects of a captured image.

Claims

1. A process for inspecting a wafer with a circuit using a charged-particle beam, comprising the steps of:

applying a primary charged-particle beam from a source of charged particles to the wafer to scan it with the beam;

applying an optical beam to the wafer before or during said a primary charged-particle beam is being applied on the wafer;

detecting secondary charged particles from the wafer, and

inspecting the continuity and discontinuity of the circuit based on changes of contrasts of detected signals.

3. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 1, wherein the wavelength of the optical beam used in the step of applying an optical beam includes wavelength of 200 to 1,200 nm.

4. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 1, wherein the wavelength of the optical beam used in the step of applying an optical beam includes wavelength of 900 to 1,200 nm.

5. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 1, wherein the optical beam is an infrared ray applied to the wafer from the back side of the wafer.

2. A process for inspecting a wafer with a circuit using a charged-particle beam, comprising the steps of:

electrifying the wafer in advance with a primary charged-particle beam from a first source of charged particles;

applying a primary charged-particle beam from a second source of charged particles to the wafer to scan it with the beam;

applying an optical beam to the wafer before or during said a primary charged-particle beam is being applied on the wafer;

detecting secondary charged particles from the wafer, and

inspecting the continuity and discontinuity of the circuit based on changes of contrasts of detected signals.

19. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 2, wherein the wavelength of the optical beam used in the step of applying an optical beam includes wavelength of 200 to 1,200 nm.

20. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 2, wherein the wavelength of the optical beam used in the step of applying an optical beam includes wavelength of 900 to 1,200 nm.

21. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 2, wherein the optical beam is an infrared ray applied to the wafer from the back side of the wafer.

6. A process for inspecting a wafer with a circuit using a charged-particle beam, comprising the steps of:

applying a primary charged-particle beam from a source of charged particles to the wafer to scan it with the beam, patterns of the circuit being formed by insulators;

applying an optical beam to the wafer before or during said a primary charged-particle beam is being applied on the wafer;

detecting secondary charged particles from the wafer;

turning the surfaces of the insulators conductive selectively in accordance with the materials of the insulators, and

inspecting the continuity and discontinuity of the circuit based on changes of contrasts of signals detected from the secondary charged particles.

7. A process for inspecting a wafer with a circuit using a charted-particle beam according to claim 6, wherein an optical beam is used to turn the surfaces of the insulators conductive.

8. A process for inspecting a wafer with a circuit using a charged-particle beam according to claim 6, wherein the wavelength of the optical beam is 150 to 200 nm.

9. A system for inspecting a wafer with a circuit using a charged-particle beam, comprising:

a wafer holder on which the wafer is placed;

a source of charged particles;

a deflector to deflect a primary charged-particle beam from the source of charged particles to scan the wafer with the beam;

an objective lens for applying the primary charged-particle beam to the wafer;

an optical source for applying an optical beam to the wafer, and

an inspection unit for applying the optical beam from the optical source to the wafer before or during said a primary charged-particle beam is being applied on the wafer, detecting secondary charged particles from the wafer, recording a secondary charged-particles image, and inspecting the continuity and discontinuity of the circuit based on contrasts of the recorded image.

10. A system for inspecting a wafer with a circuit using a charged-particle beam according to claim 9, wherein a filter is disposed between the optical source and the wafer holder.

11. A system for inspecting a wafer with a circuit using a charged-particle beam according to claim 9, wherein the wavelength of the optical beam is 900 to 1,200 nm.

12. A system for inspecting a wafer with a circuit using a charged-particle beam according to claim 9, wherein the optical beam is applied to the wafer from its back side.

13. A process for inspecting a wafer with a circuit using a charged-particle beam, comprising the step of:

applying a primary charged-particle beam from a source of charged particles to the wafer to scan it with the beam, circuit patterns of the circuit being electrically insulated from the back surface of the wafer;

applying an optical beam to the front surface of the wafer to stabilize the electric potential of the front surface before or during said a primary charged-particle beam is being applied on the wafer; and

inspecting the wafer for defective circuit patterns based on signals from secondary charged particles from the wafer.

14. An inspection process according to claim 13, wherein the wavelength of the optical beam is 150 nm or shorter.

15. An inspection process according to claim 13, wherein the primary electron beam and the optical beam are simultaneously applied to the wafer.

16. A process for inspecting a wafer with a circuit using a charged-particle beam, comprising the steps of:

applying a primary charged-particle beam from a source of charged particles to the wafer to scan it with the beam, circuit patterns of the circuit being electrically insulated from the back surface of the wafer;

applying an optical beam to surfaces of members forming the circuit patterns to electrify the front surface of the wafer positively before or during said a primary charged-particle beam is being applied on the wafer, and

inspecting the wafer for defective circuit patterns based on signals from secondary charged particles from the wafer.

17. A process for inspecting a wafer with a circuit according to claim 16, wherein the wavelength of the optical beam is 150 nm or shorter.

18. A process according to claim 16, wherein used in the step of electrifying the front surface of the wafer positively is a mechanism for adjusting the potential of an electrode which is disposed above the wafer to adjust the potential of the front surface of the wafer.