Curing light
First Claim
Patent Images
1. A curing light comprising:
- a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, a light module on said wand, said light module including a secondary heat sink, said secondary heat sink being configured to assist in heat dissipation, said secondary heat sink having a first and a second mounting platform, said first and said second mounting platforms being arranged with respect to each other at an angle θ
, said angle θ
being less than 180 degrees, first light emitting semiconductor chip module mounted on said first mounting platform, a second light emitting semiconductor chip module located on said second mounting platform, and each of said first and said second chip modules including a primary heat sink, a light emitting semiconductor chip affixed to said primary heat sink, and a cover;
wherein mounting of said primary and secondary chip modules on said first and second mounting platforms at an angle θ
with respect to each other causes light from said first and said second chip modules to overlap in an overlapping light beam that creates an overlapping light footprint that has increased light density compared to only one of said chip modules emitting light.
1 Assignment
0 Petitions
Accused Products
Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
133 Citations
20 Claims
-
1. A curing light comprising:
-
a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, a light module on said wand, said light module including a secondary heat sink, said secondary heat sink being configured to assist in heat dissipation, said secondary heat sink having a first and a second mounting platform, said first and said second mounting platforms being arranged with respect to each other at an angle θ
, said angle θ
being less than 180 degrees,first light emitting semiconductor chip module mounted on said first mounting platform, a second light emitting semiconductor chip module located on said second mounting platform, and each of said first and said second chip modules including a primary heat sink, a light emitting semiconductor chip affixed to said primary heat sink, and a cover;
wherein mounting of said primary and secondary chip modules on said first and second mounting platforms at an angle θ
with respect to each other causes light from said first and said second chip modules to overlap in an overlapping light beam that creates an overlapping light footprint that has increased light density compared to only one of said chip modules emitting light.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A curing light comprising:
-
a wand adapted to be grasped by a human hand for use in positioning and manipulating the curing light, control buttons located on said wand for use in initiating and terminating light emission by the curing light, an elongate secondary heat sink at least partially located in said wand, said secondary heat sink being configured to assist in heat dissipation, said secondary heat sink having a longitudinal axis, a proximal end and a distal end, said secondary heat sink having a first and a second mounting platform, said mounting platforms located at said secondary heat sink distal end, said first and said second mounting platforms being arranged with respect to each other at an angle θ
, said angle θ
being less than 180 degrees,a first primary heat sink mounted on said first mounting platform, a first light emitting semiconductor chip mounted to said first primary heat sink, a second primary heat sink mounted on said second mounting platform, a second light emitting semiconductor chip mounted to said second primary heat sink, wherein mounting of said primary and secondary chips on said first and second primary heat sinks on said first and second mounting platforms at an angle θ
with respect to each other causes light emitted from said first and said second chips to overlap in an overlapping light beam that creates an overlapping light footprint.- View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification