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Polishing head assembly

  • US 6,755,723 B1
  • Filed: 09/29/2000
  • Issued: 06/29/2004
  • Est. Priority Date: 09/29/2000
  • Status: Expired due to Fees
First Claim
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1. A polishing head assembly for retaining and manipulating an object having a surface that is subject to polishing, the polishing head assembly comprising:

  • a head retainer assembly;

    a load suspension plate, the load suspension plate includes a gimbal area and a load control ring;

    a gimbal post operably coupled to the head retainer assembly, the gimbal post operable to transfer a loading force to the gimbal area for distribution to the load control ring; and

    a wafer carrier head movably coupled to the head retainer assembly, the wafer carrier head operably engaged with the load control ring and deformable with the loading force to optimize flatness of an object retained on the carrier head.

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