Metal oxide film formation method and apparatus

• US 6,756,235 B1
• Filed: 08/18/2000
• Issued: 06/29/2004
• Est. Priority Date: 08/20/1999
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Liu, Yijun, Shinriki, Hiroshi, Magara, Takashi
• Primary Examiner(s): Everhart, Caridad
• Application Number:
  US09/641,681
• Time in Patent Office: 1,411 Days
• Field of Search: 438/3, 438/785, 438/681, 427/255, 427/255.1, 427/255.2, 427/255.3, 427/248.1, 427/109, 427/126.3, 118/719, 118/715, 118/730, 118/725
• US Class Current: 438/3
• CPC Class Codes: C23C 16/409 of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide
• CPC Class Codes: C23C 16/4481 by evaporation using carrier gas in contact with the source material C23C16/4486 takes precedence
• CPC Class Codes: C23C 16/45512 Premixing before introduction in the reaction chamber
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/45574 Nozzles for more than one gas

Abstract

In a metal oxide film formation method, a source gas mixture of organic compound gases containing at least three metals, and an oxidation gas are individually prepared. While the substrate is heated, the oxidation gas is supplied to a substrate set in a closed vessel at a predetermined pressure, and then the gas mixture is supplied. A metal oxide film is formed on the substrate. A metal oxide film formation apparatus is also disclosed.

Claims

1. A metal oxide film formation apparatus comprising:

a film formation chamber constituting a closed vessel;

evacuation means for evacuating an interior of said film formation chamber to a vacuum degree;

a substrate susceptor arranged in said film formation chamber to place a substrate on a surface of which a metal oxide film is to be formed;

heating means for heating the substrate set on said substrate susceptor;

first supply means for supplying a source gas mixture essentially consisting of organic compound gases containing at least three metals to the surface of the substrate set on said substrate susceptor; and

second supply means for supplying an oxidation gas to the surface of the substrate set on said substrate susceptor,

wherein said first and second supply means comprise a shower head arranged above said substrate susceptor, and said shower head comprises;

a first shower cubicle for temporarily storing a gas supplied by said first supply means;

a second shower cubicle for temporarily storing a gas supplied by said second supply means;

a plurality of first gas discharge ports communicating with said first shower cubicle; and

a plurality of second gas discharge ports communicating with said second shower cubicle.

2. An apparatus according to claim 1, wherein

said shower head comprises an upper plate, a middle plate, and a lower plate,

one of said first shower cubicle and said second shower cubicle is disposed between said upper plate and said middle plate, and

the other of said first shower cubicle and said second shower cubicle is disposed between said middle plate and said lower plate.

3. An apparatus according to claim 1, further comprising leakage prevention means for preventing leakage of a gas in said first shower cubicle and a gas in said second shower cubicle.

4. An apparatus according to claim 2, further comprising leakage prevention means, arranged between the middle and lower plates, for preventing leakage of a gas in said first shower cubicle and a gas in said second shower cubicle.

5. An apparatus according to claim 4, wherein said leakage prevention means comprises a heat-resistant sheet.

7. An apparatus according to claim 2, wherein

said first shower cubicle is disposed between said upper plate and said middle plate, and

said second shower cubicle is disposed between said middle plate and said lower plate.

8. An apparatus according to claim 7, wherein said first gas discharge ports communicate with said first shower cubicle through communication holes passing through said lower plate and said middle plate.

6. A metal oxide film formation apparatus comprising:

a film formation chamber constituting a closed vessel;

evacuation means for evacuating an interior of said film formation chamber to a vacuum degree;

a substrate susceptor arranged in said film formation chamber to place a substrate on a surface of which a metal oxide film is to be formed;

heating means for heating the substrate set on said substrate susceptor;

first supply means for supplying a source gas mixture essentially consisting of organic compound gases containing at least three metals to the surface of the substrate set on said substrate susceptor; and

second supply means for supplying an oxidation gas to the surface of the substrate set on said substrate susceptor, wherein

said first supply means comprises gasifying means for gasifying an organic compound liquid by heating, thereby generating the source gas mixture, and

said gasifying means comprises a cooling mechanism at an inlet portion for the organic compound liquid.

9. A metal oxide film formation method comprising the steps of:

providing a film formation chamber constituting a closed vessel;

evacuating an interior of said film formation chamber to a vacuum degree;

placing a substrate on a surface of which a metal oxide film is to be formed on a substrate susceptor arranged in said film formation chamber;

heating the substrate set on said substrate susceptor;

providing a source gas mixture essentially consisting of organic compound gases containing at least three metals;

mixing an oxidation gas in the source gas mixture in advance and supplying the source gas mixture to the surface of the substrate set on said substrate susceptor through a first gas discharge port; and

supplying the oxidation gas to the surface of the substrate set on said substrate susceptor through a second gas discharge port.

10. A method according to claim 9, further comprising the steps of:

supplying the source gas mixture and the oxidation gas to the substrate for a time; and

stopping supply of the source gas mixture, and then stopping supply of the oxidation gas.

11. A method according to claim 9, wherein the metals include barium, strontium, and titanium.

12. A method according to claim 9, wherein the metals include lead, zirconium, and titanium.

13. A method according to claim 9, wherein the source gas mixture is prepared by mixing organic compound gases of the metals.

14. A method according to claim 9, wherein the source gas mixture is a mixture of an organic compound gas containing two metals as constituent elements and an organic titanium compound gas.

15. A method according to claim 9, wherein the oxidation gas is one gas selected from the group consisting of oxygen gas (O₂), nitrogen dioxidation gas (NO₂), dinitrogen oxidation gas (N₂O), and ozone gas (O₃).

16. A metal oxide film formation method comprising the steps of:

providing a film formation chamber constituting a closed vessel;

evacuating an interior of said film formation chamber to a vacuum degree;

placing a substrate on a surface of which a metal oxide film is to be formed on a substrate susceptor arranged in said film formation chamber;

providing a shower head arranged above said substrate susceptor, said shower head comprising a first shower cubicle, a second shower cubicle, a plurality of first gas discharge ports communicating with said first shower cubicle, and a plurality of second gas discharge ports communicating with said second shower cubicle;

heating the substrate set on said substrate susceptor;

temporarily storing a source gas mixture essentially consisting of organic compound gases containing at least three metals in the first shower cubicle;

supplying the source gas mixture to the surface of the substrate set on said substrate susceptor through the first gas discharge ports;

temporarily storing an oxidation gas in the second shower cubicle; and

supplying the oxidation gas to the surface of the substrate set on said substrate susceptor through the second gas discharge ports.

17. A method according to claim 16, further comprising the steps of:

supplying the source gas mixture and the oxidation gas to the substrate for a time; and

stopping supply of the source gas mixture, and then stopping supply of the oxidation gas.

18. A method according to claim 16, wherein the metals include barium, strontium, and titanium.

19. A method according to claim 16, wherein the metals include lead, zirconium, and titanium.

20. A method according to claim 16, wherein the source gas mixture is prepared by mixing organic compound gases of the metals.

21. A method according to claim 16, wherein the source gas mixture is a mixture of an organic compound gas containing two metals as constituent elements and an organic titanium compound gas.

22. A method according to claim 16, wherein the oxidation gas is one gas selected from the group consisting of oxygen gas (O₂), nitrogen dioxidation gas (NO₂), dinitrogen oxidation gas (N₂O), and ozone gas (O₃).

23. A metal oxide film formation method comprising the steps of:

individually preparing a first source gas mixture essentially consisting of organic compound gases containing at least two metals, and a second source gas mixture obtained by mixing in advance an organic compound gas containing titanium and an oxidation gas;

supplying the oxidation gas to a substrate set in a closed vessel at a pressure, and then supplying the first source gas mixture and the second source gas mixture from separate gas discharge ports while the substrate is heated; and

forming a metal oxide film on the substrate.

24. A method according to claim 23, wherein the first source gas mixture includes a mixture of an organic barium compound gas and an organic strontium compound gas.

25. A method according to claim 23, wherein the first source gas mixture includes a mixture of an organic lead compound gas and an organic zirconium compound gas.