Multilayer structure with controlled internal stresses and making same

• US 6,756,285 B1
• Filed: 01/09/2002
• Issued: 06/29/2004
• Est. Priority Date: 02/10/1999
• Status: Expired due to Term

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Moriceau, Hubert, Cartier, Anne-Marie, Aspar, Bernard, Rayssac, Olivier
• Primary Examiner(s): Jones, Deborah
• Application Number:
  US09/913,006
• Time in Patent Office: 902 Days
• Field of Search: 438/455, 438/457, 438/459, 438/761, 438/620, 438/763, 438/765, 438/766, 438/769, 438/487, 428/620, 428/457, 428/469, 428/698, 428/699
• US Class Current: 438/455
• CPC Class Codes: B81C 1/00666 Treatments for controlling internal stress or strain in MEMS structures
• CPC Class Codes: B81C 2201/0167 by adding further layers of materials having complementary strains, i.e. compressive or tensile strain
• CPC Class Codes: H01L 21/185 Joining of semiconductor bodies for junction formation
• CPC Class Codes: H01L 21/76254 with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
• CPC Class Codes: Y10T 428/12528 Semiconductor component
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A multilayer structure with controlled internal stresses comprising, in this order, a first main layer (110a), at least a first constraint adaptation layer (130) in contact with the first main layer, at least a second stress adaptation layer (120) put into contact by adhesion with said first stress adaptation layer, and a second main layer (110b) in contact with the second stress adaptation layer, the first and second stress adaptation layers having contact stresses with the first and second main layers.

Application to the realization of electronic circuits and membrane devices.

Claims

1. Method for producing a multilayer structure having a defined geometrical orientation from at least a first main layer and a second main layer comprising the steps of:

(a) providing the first main layer with a first stress adaptation layer and providing at least a second stress adaptation layer between the first stress adaptation layer and the second main layer;

(b) wherein said first and second main layer is assembled via the stress adaptation layers such that stress is exerted on said main layers to cause the multilayer structure to assume a predetermined geometrical orientation selecting from the group consisting of;

convex, flat or concave geometry based upon the thickness, number and adherence of the adaptation layers.

2. The method according to claim 1, further comprising the step of forming an adherence bond between said first and second main layer.

3. The method according to claim 1, wherein the fist adaptation layer is formed from a main layer and the second adaptation layer is formed from a main layer or from the first adaptation layer with each adaptation layer having a thickness to cause stress in the first and second main layers resulting in deformation in opposite directions, respectively.

4. The method according to claim 1, further comprising forming molecular bonding between layers.

5. The method according to claim 4, wherein said molecular bonding is performed for adjusting the surface condition of the molecular layers.

6. The method according to claim 4, wherein during step b), the molecular bonding is performed at room temperature.

7. The method according to claim 2, wherein said adherence bond is formed using a bonding technique selected from the group consisting of:

brazing, welding, interdiffusion between layers, and bonding with an adhesive substance.

8. The method according to claim 1, further comprising interposing an additional adhesion layer between said main layers.

9. The method according to claim 1, wherein during step a), the fist stress adaptation layer (130, 220) is formed on the first main layer (110a, 210a) and the second stress adaptation layer (120, 230) is formed on the second main layer (110b, 210b), and wherein during step b), molecular bonding is performed between the stress adaptation layers.

10. The method according to claim 1, wherein the first and second stress adaptation layers are formed on the first main layer and wherein the second main layer is boned to one of the first and second stress adaptation layers.

11. The method according to claim 1, further comprising the step of treating at least one of the main layers after assembly to cause thinning.

12. The method according to claim 11, wherein said thinning of a main layer is formed from fracturing of said layer to form a fracture area.

13. The method according to claim 12, further comprising the step of implanting a gas species in at least one of the first or second main layers to induce a fracture area (112, 212) therein, and wherein the treating step is a thermal and/or mechanical treatment.

14. The method according to claim 1, wherein at least one stress adaptation layer is formed by a method selected from the group consisting of:

spry, epitaxy, chemical deposition, chemical vapor deposition, low pressure vapor deposition and plasma vapor deposition.

15. The method according to claim 1, wherein at least one stress adaptation layer is obtained by surface oxidization of a main layer.

16. The method according to claim 1, wherein at least one stress adaptation layer is obtained by implanting species in a main layer.

17. The method according to claim 1, wherein the main layers are composed of at least one material selected from silicon, germanium, silicon carbide, III-V type semiconductors, II-VI semiconductors, glass, superconductors, diamond, ceramic materials (LINbO₃, LiTaO₃), and quartz.