Matrix type display apparatus, method of production thereof, and thermo-compression bonding head

• US 6,756,975 B1
• Filed: 03/29/1999
• Issued: 06/29/2004
• Est. Priority Date: 12/08/1998
• Status: Expired due to Term

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Fujitsu Display Technologies Corporation (Fujitsu Limited)
• Inventors: Kamimoto, Yuji, Miyamoto, Hirofumi, Maruyama, Yoshiaki, Kishida, Katsuhiko
• Primary Examiner(s): Hjerpe, Richard
• Assistant Examiner(s): NGUYEN, KIMNHUNG T
• Application Number:
  US09/280,955
• Time in Patent Office: 1,919 Days
• Field of Search: 345/204, 345/205, 345/87, 349/152, 349/149, 349/55
• US Class Current: 345/204
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/83851 being an anisotropic conductive adhesive
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/80 Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits

Abstract

The display apparatus has a common substrate and a TFT substrate, and a flexible printed board is attached to the TFT substrate. ICs are arranged in an area of the TFT substrate in a row along an alignment direction, and connection terminals are arranged in that area by the shorter sides of the ICs along the alignment direction of the ICs. The flexible printed board and ICs can be fitted to the TFT substrate, by an anisotropic electro-conductive film, using a thermo-compression bonding head or heads.

Claims

1. A matrix type display apparatus comprising;

a first substrate;

a second substrate disposed opposite to said first substrate and having an area for mounting a plurality of driving ICs, generally in a row in a first direction parallel to one side of said second substrate so that longer sides of said driving ICs are aligned in said first direction; and

connection terminals for connection with a third substrate, said connection terminals being arranged in a row in said first direction in said area for mounting said driving ICs at positions by shorter sides of respective driving ICs.

2. A matrix type display apparatus as defined by claim 1, characterized in that leads for connecting the connection terminals with the driving ICs extend from the shorter sides of the driving ICs.

3. A matrix type display apparatus as defined by claim 1 or 2, characterized in that the driving ICs are ICs for driving data buses.

4. A matrix type display apparatus as defined by claim 1, characterized in that a distance between the driving IC and the third substrate in the arrangement direction of the plurality of driving ICs is 1.0 mm or more.