Quick sealing glass-lidded package fabrication method

• US 6,759,266 B1
• Filed: 09/04/2001
• Issued: 07/06/2004
• Est. Priority Date: 09/04/2001
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Hoffman, Paul Robert
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US09/946,861
• Time in Patent Office: 1,036 Days
• Field of Search: 438/61, 438/65, 438/116, 438/129, 438/FOR.137, 438/FOR.37, 438/FOR.379, 438/64, 438/126, 438/FOR.376
• US Class Current: 438/64
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A method of forming an image sensor package includes wire bonding bond pads of an image sensor to interior traces on a substrate with bond wires. A first optically curable material is applied to enclose the bond wires. A second optically curable material is applied between a lid and the substrate. The first and second optically curable materials are cured through the lid with ultraviolet radiation. The first and second optically curable materials are cured rapidly without heating thus minimizing the fabrication cost of the image sensor package.

Claims

1. A method comprising:

coupling an electronic component to a substrate, said electronic component comprising a first surface comprising an active area;

coupling a bond pad of said electronic component to an interior trace with a bond wire;

applying a first optically curable material between a lid and said substrate;

applying a second optically curable material to enclose said bond wire, said second optically curable material not covering and leaving exposed said active area; and

curing said first optically curable material and said second optically curable material through said lid with a first electromagnetic radiation.

2. The method of claim 1 wherein said curing comprises:

passing said first electromagnetic radiation through said lid; and

striking said first optically curable material and said second optically curable material with said first electromagnetic radiation.

3. The method of claim 1 wherein said curing causes said second optically curable material to become an encapsulant.

4. The method of claim 3 further comprising protecting said bond wire with said encapsulant.

5. The method of claim 1 wherein said curing mounts said lid to said substrate.

6. The method of claim 1 wherein said curing causes said first optically curable material to become a lid adhesive.

7. The method of claim 6 wherein said substrate, said lid, and said lid adhesive form an enclosure around said electronic component.

8. The method of claim 1 wherein said curing comprises passing said first electromagnetic radiation through said lid.

9. The method of claim 8 wherein said lid is transparent to said first electromagnetic radiation.

10. A method comprising:

coupling an electronic component to a substrate, said electronic component comprising a first surface comprising an active area;

coupling a bond pad of said electronic component to an interior trace with a bond wire;

applying a first optically curable material to enclose said bond wire, said first optically curable material not covering and leaving exposed said active area;

placing a lid on said substrate; and

curing said first optically curable material with a first electromagnetic radiation.

11. The method of claim 10 wherein said first electromagnetic radiation is ultraviolet radiation.

12. The method of claim 10 wherein said interior trace is coupled to a first surface of said substrate, an exterior trace being coupled to a second surface of said substrate, said exterior trace being electrically coupled to said interior trace.

13. The method of claim 12 wherein a pad is coupled to said exterior trace.

14. The method of claim 12 wherein an interconnection ball is coupled to said exterior trace.

15. The method of claim 10 wherein said active area is responsive to a second electromagnetic radiation.

16. The method of claim 15 wherein said lid is transparent to said second electromagnetic radiation.

17. The method of claim 16 further comprising:

directing said second electromagnetic radiation at said electronic component;

passing said second electromagnetic radiation through said lid; and

striking said active area with said second electromagnetic radiation.

18. The method of claim 10 wherein said curing causes said first optically curable material to become an encapsulant.

19. The method of claim 10 wherein said curing comprises passing said first electromagnetic radiation through said lid.

20. The method of claim 19 wherein said lid is transparent to said first electromagnetic radiation.

21. The method of claim 10 further comprising:

applying a thermally curable material between said lid and said substrate; and

curing said thermally curable material.

22. The method of claim 10 further comprising applying a second optically curable material between said lid and said substrate, wherein said curing further comprises curing said second optically curable material through said lid with said first electromagnetic radiation.

23. The method of claim 22 wherein said curing causes said second optically curable material to become a lid adhesive.

24. The method of claim 23 wherein said substrate, said lid, and said lid adhesive form an enclosure around said electronic component.

25. The method of claim 22 wherein said applying a second optically curable material between said lid and said substrate comprises applying said second optically curable material to a lid mounting surface of said substrate.

26. The method of claim 22 wherein said applying a second optically curable material between said lid and said substrate comprises applying said second optically curable material to a periphery of a first surface of said lid.

27. The method of claim 22 wherein said applying a second optically curable material between said lid and said substrate comprises squeezing said second optically curable material between said lid and said substrate.