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Quick sealing glass-lidded package fabrication method

  • US 6,759,266 B1
  • Filed: 09/04/2001
  • Issued: 07/06/2004
  • Est. Priority Date: 09/04/2001
  • Status: Active Grant
First Claim
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1. A method comprising:

  • coupling an electronic component to a substrate, said electronic component comprising a first surface comprising an active area;

    coupling a bond pad of said electronic component to an interior trace with a bond wire;

    applying a first optically curable material between a lid and said substrate;

    applying a second optically curable material to enclose said bond wire, said second optically curable material not covering and leaving exposed said active area; and

    curing said first optically curable material and said second optically curable material through said lid with a first electromagnetic radiation.

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