Method to prevent die attach adhesive contamination in stacked chips
First Claim
1. A method for preventing adhesive contamination of at least one electrical contact during manufacturing of a stacked semiconductor die package, comprising:
- providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die;
providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact;
applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and
mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam.
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Accused Products
Abstract
The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The methods and apparatus include providing a first semiconductor device with an adhesive flow control dam located on an upper surface thereof. The dam is positioned between electrical contacts and a substrate attach site on the upper surface of the first semiconductor device. The dam is rendered of a sufficient height and shape to block applied adhesive from flowing over the electrical contacts of the first semiconductor device when a second substrate is mounted onto the upper surface of the first semiconductor device. The semiconductor device package may be encapsulated with the dam in place or with the dam removed. The adhesive flow control dam thus protects the electrical contacts of the first semiconductor device from contamination by excess adhesive, which can result in unusable electrical contacts.
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Citations
51 Claims
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1. A method for preventing adhesive contamination of at least one electrical contact during manufacturing of a stacked semiconductor die package, comprising:
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providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die;
providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact;
applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and
mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of manufacturing a stacked semiconductor die package comprising:
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providing a first semiconductor die, said first semiconductor die having an upper surface, said upper surface comprising at least one electrical contact and at least one region for mounting a second semiconductor die;
providing at least one adhesive flow control dam positioned on said upper surface between said at least one region for mounting a second semiconductor die and said at least one electrical contact;
applying an adhesive to at least a portion of said at least one region for mounting a second semiconductor die; and
mounting a second semiconductor die onto said at least one region for mounting a second semiconductor die of said first semiconductor die, said adhesive prevented from contacting said at least one electrical contact by said at least one adhesive flow control dam. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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Specification