Multi-layer assembly of stacked LIMMS devices with liquid metal vias

• US 6,759,610 B1
• Filed: 06/05/2003
• Issued: 07/06/2004
• Est. Priority Date: 06/05/2003
• Status: Expired due to Fees

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Dove, Lewis R., Wong, Marvin Glenn
• Primary Examiner(s): Friedhofer, Michael A.
• Application Number:
  US10/455,031
• Time in Patent Office: 397 Days
• Field of Search: 200/182, 200/187-189, 200/209-219, 200/233-236, 310/328, 310/331, 310/348, 310/363, 335/4, 335/47, 335/78, 385/19
• US Class Current: 200/182
• CPC Class Codes: H01H 2029/008 using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
• CPC Class Codes: H01H 29/28 with level of surface of contact liquid displaced by fluid pressure

Abstract

The number of LIMMS devices in an assembly is increased by stacking multiple layers of LIMMS devices on top of one another, and interconnecting those device layers at an array of solder pads using solder balls. Each device layer uses vias to bring the needed conductors to the array of solder pads. All signals for the entire multi-layer assembly can be routed through the bottom LIMMS device layer to pass, through another array of solder pads onto a “mother substrate” of ceramic or other material that carries the multi-layer assembly. Alternatively, signals may enter or leave the upper LIMMS device layer by way of a flexible printed circuit harness. Vias may pass, either directly or by “dog legs” on interior surfaces, completely through the bottom LIMMS device layer, and through other device layers as needed. Opposing vias formed in the pair of substrates in a device layer have interior non-contacting pads that are bridged by a small ball of liquid metal held in place by a hole in a dielectric layer. Using patterned layers of dielectric to form bridging holes, cavities, channels and interconnecting passages for the LIMMS devices of both layers facilitates these needed vias and traces. Suitable thick film dielectric materials that may be deposited as a paste and subsequently cured include the KQ 150 and KQ 115 thick film dielectrics from Heraeus and the 4141A/D thick film compositions from DuPont.

Claims

1. A multi-layer electrical switching assembly comprising:

a lower switching device layer;

an upper switching device layer;

each of the lower and upper switching device layers being respectively comprised of;

a first non-conductive substrate having first and second surfaces;

a first layer of dielectric material deposited upon the first surface of the first non-conductive substrate and patterned to create heater cavities, a liquid metal channel and passages connecting the heater cavities to locations along the liquid metal channel;

a second non-conductive substrate having first and second surfaces;

a second layer of dielectric material deposited upon the first surface of the second non-conductive substrate and patterned to match at least the heater cavities of the first layer of dielectric material;

a layer of adhesive deposited on the second layer of dielectric material and patterned to match the pattern of the first layer of dielectric material; and

the first surfaces of the first and second non-conducting substrates facing each other and being brought into contact through the intervening first and second layers of dielectric material and the layer of adhesive;

the lower switching device layer having on the second surface of the first non-conductive substrate a lower pattern of conductive pads for mounting by solder balls the multi-layer electrical switching assembly at a destination location, on the first surface of the second non-conductive substrate an upper pattern of conductive pads, and a collection of vias that selectively interconnect the upper and lower patterns of pads with each other and also, by conductive traces formed on the first layer of dielectric material, with selected locations within the heater cavities and the liquid metal channel; and

the upper switching device layer having on the second surface of the first non-conductive substrate a lower pattern of conductive pads electrically connecting by solder the multi-layer electrical switching assembly to the upper pattern of conductive pads on the second surface of the second non-conductive substrate of the lower switching device layer, and a collection of vias that selectively interconnect that lower patterns of pads, by conductive traces formed on the upper switching device layer'"'"'s first layer of dielectric material, with selected locations within the heater cavities and the liquid metal channel.

2. An electrical switching assembly as in claim 1 wherein at least one of the non-conductive substrates is of glass.

3. An electrical switching assembly as in claim 1 wherein at least one of the non-conductive substrates is of ceramic.

4. An electrical switching assembly as in claim 1 further comprising conductive vias through the first non-conductive substrate and the first layer of dielectric material, an end of each of the conductive vias being within the heater cavity.

5. An electrical switching assembly as in claim 4 further comprising pads inside the heater cavity that cover the vias and a heater resistor suspended between the pads.

6. An electrical switching assembly as in claim 4 further comprising the conductive vias through the first non-conductive substrate and the first layer of dielectric material, an end of each of the conductive vias being within the liquid metal channel.

7. An electrical switching assembly as in claim 1 wherein the first and second layers of dielectric material for the upper and lower switching device layers are deposited with thick film techniques.

8. An electrical switching assembly as in claim 1 further comprising at least one flexible conductor soldered to a conductive trace that is part of one of the upper and lower switching device layers.

9. An electrical switching assembly as in claim 1 wherein the upper switching device layer further comprises an upper pattern of conductive pads on the second surface of the second non-conductive substrate and that are connected by vias in the upper switching device layer to locations within the upper switching device layer, and further wherein the multi-layer electrical switching assembly further comprises an additional switching device layer having a lower pattern of conductive pads connected to vias in the additional switching device layer and soldered to the upper pattern of conductive pads on the upper switching device layer.

10. A LIMMS assembly with a liquid metal via, the assembly comprising:

a first non-conductive substrate having first and second surfaces;

a first metallic contact pad on the first surface of the first substrate;

a first layer of dielectric material deposited upon the first surface of the first non-conductive substrate and patterned to create a via bridging hole exposing a portion of the first metallic contact pad, and also to create heater cavities, a liquid metal channel and passages connecting the heater cavities to locations along the liquid metal channel;

a second non-conductive substrate having first and second surfaces;

a second layer of dielectric material deposited upon the first surface of the second non-conductive substrate;

the via located in the second substrate and having a second metallic contact pad on the second layer of dielectric material;

a layer of adhesive deposited on the second layer of dielectric material and patterned to match the pattern of the first layer of dielectric material; and

the first surfaces of the first and second non-conducting substrates facing each other and being brought into contact through the intervening first and second layers of dielectric material and the layer of adhesive; and

a ball of liquid metal in the bridging hole and electrically connecting the first and second metallic contact pads.

11. A LIMMS assembly as in claim 10 wherein the liquid metal is mercury and the first and second metallic contact pads comprise an outer layer of Pt that was originally covered by a sacrificial layer of Au.

12. A multi-layer electrical assembly having a liquid metal via, the assembly comprising:

a first non-conductive substrate having first and second surfaces;

a first metallic contact pad on the first surface of the first substrate;

a first layer of dielectric material deposited upon the first surface of the first non-conductive conductive substrate and patterned to be absent in selected regions including at least a bridging hole exposing a portion of the first metallic contact pad;

a second non-conductive substrate having first and second surfaces;

the via located in the second substrate and having a second metallic contact pad on the first surface of the second non-conductive substrate;

a layer of adhesive deposited on the first surface of the second non-conductive substrate and patterned to match the pattern of the first layer of dielectric material; and

the first surfaces of the first and second non-conducting substrates facing each other and being brought into contact through the intervening first layer of dielectric material and the layer of adhesive; and

a ball of liquid metal in the bridging hole and electrically connecting the first and second metallic contact pads.

13. A multi-layer assembly as in claim 12 wherein the liquid metal is mercury and the first and second metallic contact pads comprise an outer layer of Pt that was originally covered by a sacrificial layer of Au.