Integrated sensor packages and methods of making the same
First Claim
1. A method of encapsulating an integrated circuit device within a plastic molded package, comprising:
- providing an integrated circuit, the integrated circuit including a sensing element;
applying a quantity of gel to the integrated circuit such as to cover at least the sensing element, thereby forming a gel-covered assembly;
inserting the gel-covered assembly into a cavity of a molding tool;
attaching a retractable pin to the gel-covered assembly;
introducing a plastic mold compound into the cavity so as to encapsulate the gel-covered assembly and at least a portion of the retractable pin; and
removing the retractable pin from the gel such as to leave a passageway in the plastic mold encapsulating the gel-covered assembly, thereby exposing the gel to an atmosphere through the passageway.
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Accused Products
Abstract
Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements. Alternatively, or in addition, an optically transmitting gel is used so as to allow for the passage of radiation at specific wavelengths.
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Citations
18 Claims
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1. A method of encapsulating an integrated circuit device within a plastic molded package, comprising:
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providing an integrated circuit, the integrated circuit including a sensing element;
applying a quantity of gel to the integrated circuit such as to cover at least the sensing element, thereby forming a gel-covered assembly;
inserting the gel-covered assembly into a cavity of a molding tool;
attaching a retractable pin to the gel-covered assembly;
introducing a plastic mold compound into the cavity so as to encapsulate the gel-covered assembly and at least a portion of the retractable pin; and
removing the retractable pin from the gel such as to leave a passageway in the plastic mold encapsulating the gel-covered assembly, thereby exposing the gel to an atmosphere through the passageway. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
attaching a second retractable pin to the second quantity of gel; and
removing the second pin from the gel so as to leave a second passageway in the plastic mold encapsulating the gel-covered assembly.
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9. The method of claim 8, further including removing a portion of the second quantity of gel so as to expose the radiation transmitting element to the atmosphere through the second passageway.
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10. The method of claim 1, wherein the integrated circuit further includes one or more electrical connectors, and wherein the gel covers a portion of a first one of the one or more electrical connectors.
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11. A method of encapsulating an integrated circuit device within a plastic molded package, comprising:
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providing an integrated circuit, the integrated circuit including a radiation sensing element and a radiation transmission element;
applying a gel to the integrated circuit such as to cover at least the radiation sensing element and the radiation transmission element, thereby forming a gel-covered assembly;
inserting the gel-covered assembly into a cavity of a molding tool;
attaching at least two retractable pins to the gel-covered assembly, a first pin contacting the gel proximal the radiation sensing element and a second pin contacting the gel proximal the radiation transmission element;
introducing a plastic mold compound into the cavity so as to encapsulate the gel-covered assembly and at least a portion of each pin, thereby forming an encapsulated assembly; and
removing the first and second pins from the gel such as to leave passageways in the plastic mold encapsulating the gel-covered assembly, thereby exposing the gel to an atmosphere through the passageways. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification