Electrical print resolution test die

• US 6,762,434 B2
• Filed: 04/23/2003
• Issued: 07/13/2004
• Est. Priority Date: 04/01/2002
• Status: Active Grant

• Current Assignee: Micrel Incorporated (Microchip Technology Incorporated)
• Original Assignee: Micrel Incorporated (Microchip Technology Incorporated)
• Inventors: Lam, Arthur, Rumsey, Robert W., Ip, Hiu F
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Stevenson, Andre C.
• Application Number:
  US10/422,165
• Publication Number:
  US 20030210058A1
• Time in Patent Office: 447 Days
• Field of Search: 257/48, 324/765, 324/258, 365/201
• US Class Current: 257/48
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633

Abstract

A test structure pattern includes a first comb, a second comb, and a serpentine line. The first comb includes a first set of tines of the same orientation. The second comb includes a second set of tines of the same orientation that are interdigitated with the first set of tines. The serpentine line runs between the interdigitated tines of the first metal comb and the second metal comb. The test structure pattern forms a first metal comb, a second metal comb, and a serpentine metal line on a die. Print quality and resolution is tested by checking for electrical continuity in the serpentine metal line and bridging between the serpentine metal line and one of the first metal comb and the second metal comb.

Claims

1. A method for determine print resolution, comprising:

forming;

a first metal comb comprising a first set of tines;

a first pad coupled in parallel to the first set of tines;

a second metal comb opposite of the first metal comb, the second metal comb comprising a second set of tines interdigitated with the first set of tines;

a second pad coupled in parallel to the second set of tines;

a serpentine metal line running between the interdigitated tines of the first metal comb and the second metal comb;

a third pad coupled to a first end of the serpentine metal line; and

a fourth pad coupled to a second end of the serpentine metal line;

supplying a current to the fourth pad; and

detecting the current at the third pad.

2. The method of claim 1, wherein the resolution is too poor, out of focus, or overexposed if the current is not detected at the third pad.

3. The method of claim 1, further comprising detecting the current at the first pad and the second pad, wherein the resoil ion is compromised if the current is detected at least at one of the first pad arid the second pad.