Integrated circuit inductors

• US 6,762,478 B2
• Filed: 05/07/2001
• Issued: 07/13/2004
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Fordé , Remmon R.
• Application Number:
  US09/850,573
• Publication Number:
  US 20010016976A1
• Time in Patent Office: 1,163 Days
• Field of Search: 257/531, 257/621, 257/924, 257/48, 257/421, 257/427
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a substrate; and

a plurality of copper segments interconnected with and alternating with a plurality of conductive segments to form a highly conductive coil interwoven with the substrate.

2. An inductor comprising:

a substrate;

an inductive structure having an inductance of at least 0.1 nanohenrys partially embedded in and interwoven with the substrate.

3. The inductor of claim 2, wherein the inductive structure is a coil.

4. The inductor of claim 2, further comprising:

a coating covering the inductive structure.

5. The inductor of claim 4, wherein the coating is an insulator and capable of protecting the inductive structure from damage.

6. An inductor comprising:

a silicon substrate including a plurality of conductive segments; and

a plurality of copper segments interconnected with and alternating with the plurality of conductive segments to form a coil interwoven with the substrate.

7. The inductor of claim 6, wherein each of the plurality of conductive segments is fabricated from gold.

8. The inductor of claim 7, wherein the coil has a substantially rectangular shape.

9. The inductor of claim 7, wherein the coil has a substantially triangular shape.

10. An inductor comprising:

a silicon carbide including a plurality of conductive segments; and

a plurality of gold segments interconnected with and alternating with the plurality of conductive segments to form a coil interwoven with the substrate.

11. The inductor of claim 10, wherein each of the plurality of conductive segments is fabricated from aluminum.

12. The inductor of claim 11, wherein the coil has a substantially circular shape.

13. The inductor of claim 11, wherein the coil has a substantially triangular shape.

14. An inductor comprising:

a germanium substrate including a plurality of conductive segments; and

a plurality of aluminum segments interconnected with and alternating with the plurality of conductive segments to form a coil interwoven with the substrate.

15. The inductor of claim 14, wherein each of the plurality of conductive segments is fabricated from copper.

16. The inductor of claim 15, wherein the coil has a substantially circular shape.

17. The inductor of claim 15, wherein the coil has a substantially rectangular shape.

18. An inductor comprising:

a gallium arsenide substrate; and

an inductive structure having an inductance of at least 0.1 nanohenrys partially embedded in and interwoven with the gallium arsenide substrate.

19. The inductor of claim 18, wherein the inductive structure comprises a triangular coil.

20. The inductor of claim 19, further comprising a coating covering the triangular coil.

21. The inductor of claim 20, wherein the coating comprises an insulator.

22. An inductor comprising:

a silicon carbide substrate; and

an inductive structure having an inductance of at least 0.1 nanohenrys partially embedded in and interwoven with the silicon carbide substrate.

23. The inductor of claim 22, wherein the inductive structure comprises a rectangular coil.

24. The inductor of claim 23, further comprising a coating covering the rectangular coil.