Semiconductor encapsulant resin having an additive with a gradient concentration

• US 6,762,508 B1
• Filed: 02/24/1999
• Issued: 07/13/2004
• Est. Priority Date: 02/27/1998
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Yamada, Satoru, Shiotsuka, Hidenori, Kataoka, Ichiro, Kiso, Shigeo, Zenko, Hideaki
• Primary Examiner(s): Picardat, Kevin M.
• Application Number:
  US09/256,227
• Time in Patent Office: 1,966 Days
• Field of Search: 257/787-795, 257/655, 136/251-252, 136/256, 136/258-259
• US Class Current: 257/787
• CPC Class Codes: B32B 17/04 bonded with or embedded in a plastic substance
• CPC Class Codes: B32B 17/10678 comprising UV absorbers or stabilizers, e.g. antioxidants
• CPC Class Codes: B32B 17/10788 containing ethylene vinylacetate
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 31/048 Encapsulation of modules
• CPC Class Codes: H01L 31/0481 characterised by the composition of the encapsulation material
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

Provided is an encapsulant resin for a semiconductor that effectively functions even with a relatively small amount of an additive.

The encapsulant resin for a semiconductor is characterized in that the additive has a concentration gradient in the direction of thickness of the encapsulant resin. Specifically, the concentration gradient of the additive is established in the direction of thickness of the encapsulant resin by stacking at least two types of organic polymer resins containing different contents of the additive to form the encapsulant resin or by applying an electric field to the encapsulant resin to effect electrophoresis of the polar additive in the encapsulant resin.

Claims

1. A photovoltaic element encapsulated in a stack structure with a front surface member, a front surface encapsulant resin, a back surface encapsulant resin, and a back surface member in an order of the front surface member, the front surface encapsulant resin, the photovoltaic element, the back surface encapsulant resin, and the back surface member, wherein the front surface encapsulant resin comprises a hot-melt polymer resin having an ultraviolet absorbing agent dissolved therein, wherein the dissolved ultraviolet absorbing agent has a concentration gradient in the direction of thickness of the encapsulant resin, and

wherein the concentration of the ultraviolet absorbing agent is higher at a location near a light incident surface of the front surface encapsulant resin.

2. The photovoltaic element according to claim 1, further comprising a silane coupling agent dissolved in the encapsulant resin.

3. The photovoltaic element according to claim 2, wherein the silane coupling agent is higher at a location near the photovoltaic element.

4. The photovoltaic element according to claim 2, wherein the concentration of the silane coupling agent is higher at a location in the encapsulant resin near the surface member.