Method of manufacturing electronic tag
First Claim
Patent Images
1. An electronic tag, comprising:
- a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for covering a part of the conductor piece in which the slit is formed.
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Accused Products
Abstract
In the event of the shipment of electronic tags from a manufacturer to a customer, a number of the electronic tags required by the customer are adhered to a double-faced adhesive tape and then the double-faced adhesive tape is wound on a reel. Then, this reel is contained in a case and shipped to the customer. The electronic tag is adhered to an article in the following manner. That is, the double-faced adhesive tape is cut to obtain pieces of the electronic tags, and the cover tape on the rear surface of the double-faced adhesive tape is peeled, and then, the electronic tag is adhered to the article by the use of the double-faced adhesive tape.
26 Citations
14 Claims
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1. An electronic tag, comprising:
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a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for covering a part of the conductor piece in which the slit is formed. - View Dependent Claims (2, 3, 4)
wherein the semiconductor chip and the wire are sealed with the resin. -
3. The electronic tag according to claim 2,
wherein the resin includes a potting resin. -
4. The electronic tag according to claim 1,
wherein the resin covers only one surface of the conductor piece.
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5. An electronic tag, comprising:
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a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, wherein the slit extends in a direction diagonal to the extending direction of the outer edge of the conductor piece.
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6. An electronic tag, comprising:
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a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, wherein the one end of the wire is electrically connected to a bump electrode formed on a device forming area of the semiconductor chip. - View Dependent Claims (7)
wherein an organic insulating film is formed on the device forming area of the semiconductor chip, and the bump electrode is formed on the organic insulating film.
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8. An electronic tag, comprising:
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a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, wherein a rear surface of the semiconductor chip is electrically connected to the conductor piece.
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9. An electronic tag, comprising:
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a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, wherein a width of the slit is narrower than that of the conductor piece near the slit.
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10. An electronic tag, comprising:
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a rectangular conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, wherein a planar shape of the resin is a rectangle having a longitudinal length of the conductor piece longer than the lateral length thereof. - View Dependent Claims (11, 13, 14)
wherein a part of the conductor piece in which the slit is formed is covered with the resin. -
13. The electronic tag according to claim 11,
wherein the resin includes a potting resin. -
14. The electronic tag according to claim 11,
wherein the resin includes a molding resin.
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12. An electronic tag, comprising:
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a conductor piece constituting an antenna;
a slit formed in a part of the conductor piece and having an end extending to an outer edge of the conductor piece;
a semiconductor chip mounted on the conductor piece near the slit;
a wire having one end bonded to an electrode of the semiconductor chip and the other end bonded to an area of the conductor piece facing to a semiconductor chip mounting area across the slit; and
resin for sealing the semiconductor chip and the wire, wherein the resin covers only one surface of the conductor piece.
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Specification