Break away, high speed, folded, jumperless electronic assembly

• US 6,762,942 B1
• Filed: 09/05/2002
• Issued: 07/13/2004
• Est. Priority Date: 09/05/2002
• Status: Expired due to Fees

• Current Assignee: Gary W. Smith
• Original Assignee: Gary W. Smith
• Inventors: Smith, Gary W.
• Primary Examiner(s): Martin, David
• Assistant Examiner(s): BUI, HUNG S
• Application Number:
  US10/235,408
• Time in Patent Office: 677 Days
• Field of Search: 361/749, 361/720, 361/736, 361/748, 361/760, 174/258, 174/260, 174/262, 257/686, 257/712
• US Class Current: 361/749
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278
• CPC Class Codes: H05K 7/1431 Retention mechanisms for CPU modules

Abstract

Two substrate leaves are coupled by a folded flexible circuit medium. Integrated circuit components can be mounted to opposite faces of both leaves. A signal terminal projects from one of the leaves. Both leaves include paths for communicating signals between their respective components and the terminal. Preferably the leaves are formed by two outer, rigid substrates each laminarly affixed to a respcective inner substrate, the inner substrates being separate sections of the folded circuit medium and the outer substrates being separated sections of a rigid circuit medium. Components are mounted to the exposed faces of the substrates. The fold includes paths for communicating signals between the leaf distal from the terminal and the terminal, the signal paths between one leaf and the terminal being closely matched in length and impedance to corresponding paths between the other leaf and the terminal.

Claims

1. A modular electronic assembly comprising:

(a) two component substrate leaves including respective substrate sections of a broken away rigid circuit medium;

(b) a fold coupling the two leaves together in spaced relation;

(c) a plurality of components distributed over, and coupled to, faces of the leaves;

(d) a signal terminal projecting from one of the leaves;

(e) both leaves including signal paths for communicating signals between their respective components and the terminal; and

(f) the fold including signal paths for communicating signals between the leaf distal from the terminal and the terminal.

2. The modular electronic assembly according to claim 1 further comprising a plurality of spaced apertures defined through the fold for enabling cooling air flow over components within the space between the leaves.

3. The modular electronic assembly according to claim 1 wherein the fold is defined by a flexible circuit medium folded substantially 180 degrees, the flexible circuit medium including component substrates disposed beyond the fold which are an integral part of respective substrate leaves.

4. The modular electronic assembly according to claim 3 wherein each broken-away section of the rigid substrate medium is laminarly affixed to a respective flexible circuit medium component substrate.

5. The modular electronic assembly according to claim 3 wherein the fold further comprises a signal reference plane therein or thereon continuous with the flexible circuit medium substrates.

6. The modular electronic assembly according to claim 1 wherein the fold further comprises a signal reference plane therein or thereon continuous with respective reference planes of the leaves.

7. The modular electronic assembly according to claim 1 wherein the terminal comprises a connector edge, the edge being defined by the breaking away of the substrate sections of the rigid circuit medium.

19. The memory module according to claim 1 wherein the fold is defined by a flexible circuit medium folded substantially 180 degrees, the flexible circuit medium including memory component substrates disposed beyond the fold which are an integral part of respective substrate leaves.

20. The memory module according to claim 19 wherein each broken-away section of the rigid substrate medium is laminarly affixed to a respective flexible circuit medium memory component substrate.

8. A modular electronic assembly comprising:

(a) four component substrates sandwiched together, the two outer substrates being rigid relative to the two inner substrates, the two inner subsumes being separate sections of a folded flexible circuit medium;

adjacent inner and outer subsumes being laminarly affixed together forming two spaced leaves joined by the fold of the flexible circuit medium;

(b) a plurality of components distributed over, and coupled to, the exposed faces of the substrates;

(c) a signal terminal projecting from one of the outer substrates;

(d) both leaves including signal paths for communicating signals between their respective components and the terminal; and

(e) the fold including signal paths for communicating signals between the leaf distal from the terminal and the terminal.

9. The modular electronic assembly according to claim 8 wherein:

(a) the inner substrate proximal to the terminal includes signals paths for communicating signals between its components and the terminal via corresponding signal paths in or on said one of the outer substrates; and

(b) both subsumes distal from the terminal include signal paths for communicating between their respective components and the terminal via corresponding signal paths in or on the fold.

10. The modular electronic assembly according to claim 8 further comprising a plurality of spaced holes defined trough the fold for enabling ambient air flow over memory components within the space between the leaves.

11. The modular electronic assembly according to claim 9 further comprising a plurality of spaced holes defined through the fold for enabling ambient air flow over memory components within the space between the leaves.

12. The modular electronic assembly according to claim 8 wherein the fold further comprises a signal reference plane therein or thereon.

13. The modular electronic assembly according to claim 9 wherein the fold further comprises a signal reference plane therein or thereon.

14. The modular electronic assembly according to claim 8 wherein the outer substrates further comprise sections of a printed circuit board separated along an axis.

15. The modular electronic assembly according to claim 14 wherein the sections are separated by being broken along a breakaway defined by the printed circuit board along the axis.

16. The modular electronic assembly according to claim 14 wherein the terminal comprises a plurality of signal tabs disposed on the printed circuit board, the signal tabs being mutually aligned along one side with the axis and adjacent thereto.

17. The modular electronic assembly according to claim 15 wherein the terminal comprises a plurality of signal tabs disposed on the printed circuit board, the signal tabs being mutually aligned along one side with the axis and adjacent thereto.

18. A memory module comprising:

(a) two memory component substrate leaves including respective substrate sections of a broken away rigid circuit medium;

(b) a fold coupling the two leaves together in spaced relation;

(c) a plurality of memory components distributed over, and coupled to, faces of the leaves;

(d) a signal terminal projecting from one of the leaves;

(e) both leaves including signal paths for communicating memory access related signals between their respective memory components and the terminal; and

(f) the fold including signal paths for communicating memory access related signals between the leaf distal from the terminal and the terminal.