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Polishing apparatus

  • US 6,764,381 B2
  • Filed: 03/17/2003
  • Issued: 07/20/2004
  • Est. Priority Date: 01/17/2000
  • Status: Expired due to Term
First Claim
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1. A polishing apparatus comprising:

  • a polishing table having a polishing surface;

    a top ring for holding a substrate and pressing a surface of the substrate against said polishing surface to polish said surface of the substrate; and

    an eddy-current sensor for measuring the thickness of a conductive layer formed on said surface of the substrate;

    wherein said eddy-current sensor is used for monitoring the polishing process by monitoring the combined impedance of said eddy-current sensor and said conductive layer.

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