Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials
First Claim
1. A method of removing waste material from a semiconductor wafer, the method comprising:
- (a) receiving the semiconductor wafer in a chamber;
(b) dissolving a reagent into a supercritical solvent to create a supercritical solution; and
(c) providing the supercritical solution to the chamber to thereby contact at least one surface of the wafer and remove at least a portion of the waste material from the semiconductor wafer;
wherein the reagent facilitates removal of the material, and wherein the reagent comprises at least one of an ammonium bicarbonate prepared ahead of time, prior to contact with the supercritical solvent, and an ammonium carbonate prepared ahead of time, prior to contact with the supercritical solvent.
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Accused Products
Abstract
Disclosed formulations of supercritical solutions are useful in wafer cleaning processes. Supercritical solutions of the invention may be categorized by their chemistry, for example, basic, acidic, oxidative, and fluoride chemistries are used. Such solutions may include supercritical carbon dioxide and at least one reagent dissolved therein to facilitate removal of waste material from wafers, particularly for removing photoresist and post-etch residues from low-k materials. This reagent may include an ammonium carbonate or bicarbonate, and combinations of such reagents. The solution may include one or more co-solvents, chelating agents, surfactants, and anti-corrosion agents as well.
178 Citations
25 Claims
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1. A method of removing waste material from a semiconductor wafer, the method comprising:
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(a) receiving the semiconductor wafer in a chamber;
(b) dissolving a reagent into a supercritical solvent to create a supercritical solution; and
(c) providing the supercritical solution to the chamber to thereby contact at least one surface of the wafer and remove at least a portion of the waste material from the semiconductor wafer;
wherein the reagent facilitates removal of the material, and wherein the reagent comprises at least one of an ammonium bicarbonate prepared ahead of time, prior to contact with the supercritical solvent, and an ammonium carbonate prepared ahead of time, prior to contact with the supercritical solvent. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification