System and method for qualifying multiple device under test (DUT) test head
First Claim
Patent Images
1. A method for qualifying a multiple die under test head comprising:
- providing a test apparatus comprising a multiple die under test head;
providing a calibration standard substrate having a plurality of die arrays which may be tested while employing the multiple die under test head;
classifying the plurality of die arrays with respect to;
position within the calibration standard substrate; and
defective die and non-defective die within a series of die locations within each of the plurality of die arrays;
selecting from the plurality of die arrays a sub-set of die arrays which;
do not overlap in position within the calibration standard substrate; and
have in an aggregate no greater than one defective die within each of the series of die locations; and
qualifying the multiple die under test head through measurement of the sub-set of die arrays.
1 Assignment
0 Petitions
Accused Products
Abstract
Each of a system for qualifying a multiple die under test head and a system for qualifying the multiple die under test head employ selection of a sub-set of die arrays within a calibration standard substrate. The sub-set of die arrays is selected such as to: (1) not overlap in position within the calibration standard substrate; and (2) have in an aggregate no greater than one defective die within each of a series of die locations. The system and the method provide for accurate and efficient qualification of the multiple die under test head and thus accurate and efficient electrical test measurement of a microelectronic product.
13 Citations
14 Claims
-
1. A method for qualifying a multiple die under test head comprising:
-
providing a test apparatus comprising a multiple die under test head;
providing a calibration standard substrate having a plurality of die arrays which may be tested while employing the multiple die under test head;
classifying the plurality of die arrays with respect to;
position within the calibration standard substrate; and
defective die and non-defective die within a series of die locations within each of the plurality of die arrays;
selecting from the plurality of die arrays a sub-set of die arrays which;
do not overlap in position within the calibration standard substrate; and
have in an aggregate no greater than one defective die within each of the series of die locations; and
qualifying the multiple die under test head through measurement of the sub-set of die arrays. - View Dependent Claims (2, 3, 4, 5, 6, 7, 9, 10, 11, 12, 13, 14)
-
-
8. A method for qualifying a multiple die under test head comprising:
-
providing a test apparatus comprising a multiple die under test head;
providing a calibration standard substrate having a plurality of die arrays which may be tested while employing the multiple die under test head;
classifying the plurality of die arrays with respect to;
position within the calibration standard substrate; and
defective die and non-defective die within a series of die locations within each of the plurality of die arrays;
selecting from the plurality of die arrays a sub-set of die arrays which;
do not overlap in position within the calibration standard substrate; and
have in an aggregate no greater than one defective die within each of the series of die locations; and
electrically testing the sub-set of die arrays; and
diqualifying the multiple die under test head if any of the series of die locations electrically test as greater than one defective die.
-
Specification