Omnidirectional microscale impact switch
First Claim
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1. An omnidirectional inertial switch, comprising:
- a substrate die including a centrally located pedestal, a trough area surrounding the pedestal, a perimeter land area surrounding the trough area, a bottom ring electrode disposed in the trough area and a contact lead connected to the bottom ring electrode;
a bottom switch assembly disposed on the substrate die, the bottom switch assembly including a conductive device layer and a conductive link, the device layer including a centrally located anchor, at least one spring, a proof mass connected to the anchor by the at least one spring and located opposite the bottom ring electrode, at least one contact electrode disposed radially outward from the proof mass and a contact lead connected to the at least one contact electrode, the conductive link being disposed on the anchor; and
a cover plate assembly disposed on the bottom switch assembly, the cover plate assembly including a top plate, a non-conductive spacer disposed between the top plate and the bottom switch assembly, a center electrode that contacts the conductive link and a top ring electrode located opposite the proof mass;
wherein an x-axis gap and a y-axis gap are defined between the proof mass and the at least one contact electrode, a bottom z-axis gap is defined between the bottom ring electrode and the proof mass and a top z-axis gap is defined between the top ring electrode and the proof mass.
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Abstract
The invention is a normally-open, momentary, non-latching, inertial thresholding switch 30, fabricated on a substrate 1 in a planar configuration, using no cylindrical tilt mass, with low mass 16 and small switch gap 36, 37, 38, 39 to allow fast switch action and rapid reset. Of ultra-miniature, rugged construction, its high mechanical frequency limits sensitivity to vibration inputs.
40 Citations
12 Claims
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1. An omnidirectional inertial switch, comprising:
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a substrate die including a centrally located pedestal, a trough area surrounding the pedestal, a perimeter land area surrounding the trough area, a bottom ring electrode disposed in the trough area and a contact lead connected to the bottom ring electrode;
a bottom switch assembly disposed on the substrate die, the bottom switch assembly including a conductive device layer and a conductive link, the device layer including a centrally located anchor, at least one spring, a proof mass connected to the anchor by the at least one spring and located opposite the bottom ring electrode, at least one contact electrode disposed radially outward from the proof mass and a contact lead connected to the at least one contact electrode, the conductive link being disposed on the anchor; and
a cover plate assembly disposed on the bottom switch assembly, the cover plate assembly including a top plate, a non-conductive spacer disposed between the top plate and the bottom switch assembly, a center electrode that contacts the conductive link and a top ring electrode located opposite the proof mass;
wherein an x-axis gap and a y-axis gap are defined between the proof mass and the at least one contact electrode, a bottom z-axis gap is defined between the bottom ring electrode and the proof mass and a top z-axis gap is defined between the top ring electrode and the proof mass.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification