Ruggedized electronics enclosure

• US 6,765,793 B2
• Filed: 08/30/2002
• Issued: 07/20/2004
• Est. Priority Date: 08/30/2002
• Status: Active Grant

• Current Assignee: Mercury Systems - Trusted Mission Solutions, Inc. (Mercury Systems, Incorporated)
• Original Assignee: The Themis Intellectual Property Counsel
• Inventors: Kehret, William E., Smith, Dennis H.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US10/232,915
• Publication Number:
  US 20040042175A1
• Time in Patent Office: 690 Days
• Field of Search: 165/80.3, 165/121, 165/126, 165/185, 361/683-687, 361/690, 361/694-696, 361/700-710, 361/724-727, 312/326, 454/184
• US Class Current: 361/690
• CPC Class Codes: H05K 7/1434 for electronics exposed to high gravitational force; Cylindrical housings
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

The present invention relates to a ruggedized enclosure for housing and protecting electronics circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to form a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.

Claims

1. A ruggedized electronics enclosure for housing an electronic circuit comprising:

a top compartment configured to house the electronic circuit; and

a cooling assembly comprising a rigid truss plate structure, rigidly coupled to the top compartment and thermally coupled to the electronic circuit, the top compartment, cooling assembly, and electronic circuit providing a rigid structure;

that does not substantially deform in response to one or more destructive shock events, to protect the electronic circuit against said one or more destructive shock events.

2. The ruggedized electronics enclosure of claim 1 wherein the rigid truss plate structure is configured to remove heat generated by the electronic circuit and to provide support against destructive vibration events and destructive shock events experienced by the ruggedized electronics enclosure.

3. The ruggedized electronics enclosure of claim 1 wherein the top compartment and cooling assembly form a protective structure with a resonant frequency higher than the frequency of a destructive vibration event.

4. The ruggedized electronics enclosure of claim 3 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 200 Hz to 1 kHz, for aircraft and land-based applications.

5. The ruggedized electronics enclosure of claim 3 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 20 Hz to 40 Hz.

6. The ruggedized electronics enclosure of claim 1 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 20 G'"'"'s.

7. The ruggedized electronics enclosure of claim 1 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 40 G'"'"'s.

8. The ruggedized electronics enclosure of claim 1 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 60 G'"'"'s.

9. The ruggedized electronics enclosure of claim 1 wherein the top compartment completely encloses the electronic circuit.

10. The ruggedized electronics enclosure of claim 9 wherein the top compartment is sealed to prevent moisture and particles from entering the top compartment.

11. The ruggedized electronics enclosure of claim 1 wherein the ruggedized electronics enclosure is formed from a material with a low mass and high stiffness to increase the resonant frequency of the enclosure.

12. The ruggedized electronics enclosure of claim 11 wherein the ruggedized electronics enclosure is substantially formed from aluminum.

13. The ruggedized electronics enclosure of claim 1 wherein the cooling assembly and top compartment cooperate to form a structure with a low vertical profile.

14. The ruggedized electronics enclosure of claim 1 wherein:

the top compartment comprises a heat spreader plate coupled to the cooling assembly; and

the cooling assembly comprises;

a bottom plate; and

a passive radiator coupled to the heat spreader plate and to the bottom plate to form the rigid truss plate structure.

15. The ruggedized electronics enclosure of claim 14 wherein the cooling assembly is configured to allow air to pass through a passageway formed by the heat spreader plate, bottom plate, and the passive radiator.

16. The ruggedized electronics enclosure of claim 14 wherein the passive radiator comprises a corrugated fin.

17. The ruggedized electronics enclosure of claim 16 wherein the corrugated fin is formed from one of copper, aluminum or composite materials.

18. The ruggedized electronics enclosure of claim 16 wherein the corrugated fin provides support against destructive shear forces in the horizontal plane and provides support against destructive twisting and flexing of the ruggedized electronics enclosure.

19. The ruggedized electronics enclosure of claim 14 wherein the passive radiator comprises a triangular fin structure.

20. The ruggedized electronics enclosure of claim 19 wherein the triangular fin structure provides support against destructive shear forces in the horizontal plane and provides support against destructive twisting and flexing of the ruggedized electronics enclosure.

21. The ruggedized electronics enclosure of claim 14 wherein the passive radiator comprises a plurality of pin-style heatsinks.

22. The ruggedized electronics enclosure of claim 21 wherein the pin-style heatsinks are arranged in a pattern of varying pin density, or profile, to form a turbulence gradient and configured to provide an even heat dissipation across the heat spreader plate.

23. The ruggedized electronics enclosure of claim 21 wherein the heat spreader plate varies in thickness to provide an even temperature distribution across the heat spreader plate.

24. The ruggedized electronics enclosure of claim 14 wherein the cooling assembly further comprises heat pipes configured to draw heat away from the cooling assembly to a point external to the ruggedized electronics enclosure.

25. The ruggedized electronics enclosure of claim 1 wherein the top compartment further comprises a thermal interposer configured to remove heat from the electronic circuit.

26. A ruggedized electronics enclosure comprising:

an enclosure means for housing and protecting an electronic circuit; and

an external cooling means having a rigid truss plate structure, rigidly coupled to the enclosure means and thermally coupled to the electronic circuit for rigidifying the electronics enclosure, said electronics enclosure does not substantially deform in response to destructive shock events and destructive vibration events, and for transferring heat generated by the electronic circuit.

27. The ruggedized electronics enclosure of claim 26 wherein the external cooling means comprises a passive radiator.

28. The ruggedized electronics enclosure of claim 26 wherein the external cooling means receives an externally induced air flow to aid in heat transfer.

29. The ruggedized electronics enclosure of claim 26 wherein the enclosure means and external cooling means raise the resonant frequency of the ruggedized electronics enclosure above the frequency of a destructive vibration event.

30. The ruggedized electronics enclosure of claim 29 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 200 Hz to 1 kHz, for land based and aircraft applications.

31. The ruggedized electronics enclosure of claim 29 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 20 Hz to 40 Hz, for shipboard applications.

32. The ruggedized electronics enclosure of claim 26 wherein the ruggedized electronics enclosure is configured to fully protect the electronic circuit from a destructive shock event of at least 20 G'"'"'s.

33. The ruggedized electronics enclosure of claim 26 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 40 G'"'"'s.

34. The ruggedized electronics enclosure of claim 26 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event in the range of at least 60 G'"'"'s.

35. The ruggedized electronics enclosure of claim 26 wherein the cooling means further provides protection against destructive shear forces.

36. The ruggedized electronics enclosure of claim 26 wherein the enclosure means further comprises a thermal interposer means for transferring heat away from the electronic circuit and for dissipating vibrations events.

37. A method of housing and protecting an electronic circuit in a ruggedized electronics enclosure comprising:

enclosing the electronic circuit in a top compartment;

externally cooling the electronic circuit with a rigid cooling assembly and

rigidifying the electronics enclosure by rigidly coupling the cooling assembly comprising

rigid truss plate structures to the top compartment, wherein said rigidified electronics enclosure does not substantially deform in response to one or more destructive shock events.

38. The method of claim 37 wherein the step of rigidifying comprises the step of sharing a common structural plate, and side walls, between the top compartment and the rigid cooling assembly.

39. The method of claim 37 wherein:

the cooling assembly comprises a passive radiator; and

the step of cooling comprises conducting the heat generated by the electronic circuit to the passive radiator.

40. The method of claim 37 wherein the step of cooling includes receiving an external air flow to aid in dissipating the heat.

41. The method of claim 37 further includes raising the resonant frequency of the ruggedized electronics enclosure above the frequency of a destructive vibration event by selecting the mass and rigidity of the top compartment and cooling assembly and their materials.

42. The method of claim 41 wherein the resonant frequency of the ruggedized electronics enclosure is in the range 200 Hz to 1 kHz, for land-based aircraft applications.

43. The method of claim 37 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 20 Hz to 40 Hz, for shipboard applications.

44. The method of claim 37 wherein the ruggedized electronics enclosure fully protects the electronic circuit from a destructive shock event of at least 20 G'"'"'s.

45. The ruggedized electronics enclosure of claim 37 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 40 G'"'"'s.

46. The ruggedized electronics enclosure of claim 37 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event at least 60 G'"'"'s.

47. The method of claim 37 wherein the cooling assembly provides protection against shear force.

48. A ruggedized electronics enclosure for housing an electronic circuit comprising:

a top compartment configured to house the electronic circuit; and

a cooling assembly rigidly comprising a truss plate structure, coupled to the top compartment and thermally coupled to the electronic circuit, the top compartment and cooling assembly forming a rigid structure with a resonant frequency greater than the frequency of a destructive vibration event, wherein said rigid structure does not substantially resonate in response to said destructive vibration event.

49. The ruggedized electronics enclosure of claim 48 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 20 G'"'"'s.

50. The ruggedized electronics enclosure of claim 48 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 40 G'"'"'s.

51. The ruggedized electronics enclosure of claim 48 wherein the ruggedized electronics enclosure is configured to protect the electronic circuit against a shock event of at least 60 G'"'"'s.

52. The ruggedized electronics enclosure of claim 48 wherein the top compartment and cooling assembly provide a structure to protect the electronic circuit from at least one destructive shock event.

53. The ruggedized electronics enclosure of claim 48 wherein the top compartment completely encloses the electronic circuit.

54. The ruggedized electronics enclosure of claim 53 wherein the top compartment is sealed to prevent moisture and particles from entering the top compartment.

55. The ruggedized electronics enclosure of claim 48 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 200 Hz-1 kHz for aircraft and land-based applications.

56. The ruggedized electronics enclosure of claim 48 wherein the resonant frequency of the ruggedized electronics enclosure is in the range of 20 Hz to 40 Hz for shipboard applications.

57. The ruggedized electronics enclosure of claim 48 wherein the ruggedized electronics enclosure is formed from a material with a low mass and high stiffness to increase the resonant frequency of the enclosure.

58. The ruggedized electronics enclosure of claim 57 wherein the ruggedized electronics enclosure is substantially formed from aluminum.

59. The ruggedized electronics enclosure of claim 48 wherein the cooling assembly and the top compartment cooperate to form a low-vertical-profile structure.

60. The ruggedized electronics enclosure of claim 48 wherein:

the top compartment comprises a heat spreader plate coupled to the cooling assembly; and

the cooling assembly comprises;

a bottom plate; and

a passive radiator coupled to the heat spreader plate and to the bottom plate to form the rigid truss plate structure.

61. The ruggedized electronics enclosure of claim 60 wherein the cooling assembly is configured to allow air to pass through a passageway formed by the heat spreader plate, bottom plate and the passive radiator.

62. The ruggedized electronics enclosure of claim 60 wherein the rigid truss plate structure is configured to radiate heat generated by the electronic circuit and to provide support against a destructive vibration event or a destructive shock event experienced by the ruggedized electronics enclosure.

63. The ruggedized electronics enclosure of claim 60 wherein the passive radiator comprises a corrugated fin.

64. The ruggedized electronics enclosure of claim 63 wherein the corrugated fin is formed from either copper, aluminum or carbon composites.

65. The ruggedized electronics enclosure of claim 63 wherein the corrugated fin provides support against destructive shear forces in the horizontal plane and provides support against destructive twisting and flexing of the ruggedized electronics enclosure.

66. The ruggedized electronics enclosure of claim 60 wherein the passive radiator comprises a triangular fin structure.

67. The ruggedized electronics enclosure of claim 66 wherein the triangular fin structure provides support against shear forces in the horizontal plane and provides support against twisting and flexing of the ruggedized electronics enclosure.

68. The ruggedized electronics enclosure of claim 60 wherein the passive radiator comprises a plurality of pin-style heatsinks.

69. The ruggedized electronics enclosure of claim 68 wherein the pin-style heatsinks are arranged in a pattern of varying pin density to form a turbulence gradient and configured to provide an even heat dissipation across the heat spreader plate.

70. The ruggedized electronics enclosure of claim 60 wherein the heat spreader plate varies in thickness to form a thermal gradient to provide an even heat dissipation across the heat spreader plate.

71. The ruggedized electronics enclosure of claim 60 wherein the cooling assembly further comprises heat pipes configured to draw heat away from the cooling assembly to a point external to the ruggedized electronics enclosure.