Optical track drain package

• US 6,765,801 B1
• Filed: 06/25/2001
• Issued: 07/20/2004
• Est. Priority Date: 06/25/2001
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Hollaway, Roy Dale
• Primary Examiner(s): Cuneo, Kamand
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/891,678
• Time in Patent Office: 1,121 Days
• Field of Search: 361/760-764, 361/782-784, 174/52.2, 174/259-261, 257/686-690, 257/723-724, 257/787-792, 438/112-116
• US Class Current: 361/764
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/02253 using lenses
• CPC Class Codes: H01S 5/02257 using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
• CPC Class Codes: H01S 5/0239 Combinations of electrical or optical elements

Abstract

A package includes a substrate having a pocket, an overflow reservoir around a periphery of the pocket, and a mating surface around a periphery of the overflow reservoir. An electronic component is mounted within the pocket. The pocket is over filled with a flowable material. A window or waveguide is mounted to the substrate. The overflow reservoir captures the flowable material that spills out of the pocket during mounting of the window or waveguide thus preventing contamination of the mating surface.

Claims

1. A package comprising:

a substrate comprising;

a pocket;

an overflow reservoir around a periphery of said pocket; and

a mating surface around a periphery of said overflow reservoir;

a first electronic component coupled within said pocket;

a sealing encapsulant filling said pocket, said sealing encapsulant comprising an exterior surface coplanar with said mating surface; and

excess encapsulant within said overflow reservoir, wherein said excess encapsulant comprises an exterior surface below said mating surface.

2. The package of claim 1 further comprising a second electronic component coupled within said pocket.

3. The package of claim 1 wherein said first electronic component is coupled within said pocket in a configuration selected from the group consisting of a wirebond configuration, a surface mount configuration and a flip chip configuration.

4. The package of claim 1 wherein said substrate further comprises:

a pocket base surface; and

a pocket sidewall surface, said pocket base surface and said pocket sidewall surface defining said pocket.

5. The package of claim 1 wherein said sealing encapsulant comprises a cured flowable material.

6. The package of claim 1 wherein said exterior surface of said sealing encapsulant has a smoothness approximate equal to a smoothness of glass.

7. The package of claim 1 wherein said sealing encapsulant is opaque.

8. The package of claim 1 wherein said excess encapsulant is formed of a same material as said sealing encapsulant.

9. The package of claim 1 wherein said substrate further comprises:

a pocket base surface;

a pocket sidewall surface, said pocket base surface and said pocket sidewall surface defining said pocket;

a drain base surface;

a drain inner sidewall surface;

a drain outer sidewall surface, said drain base surface, said drain inner sidewall surface, and said drain outer sidewall surface defining said overflow reservoir; and

a runner surface extending between said drain inner sidewall surface and said pocket sidewall surface.

10. The package of claim 4 wherein said first electronic component comprises a first surface comprising a bond pad and a second surface coupled to said pocket base surface, said package further comprising:

a pin extending through said pocket base surface and through said substrate and protruding from a lower surface of said substrate; and

a bond wire electrically coupling said bond pad to said pin.

11. The package of claim 4 wherein said first electronic component comprises a first surface comprising a bond pad and a second surface coupled to said pocket base surface, said package further comprising:

an inner trace coupled to said pocket base surface;

a bond wire electrically coupling said bond pad to said inner trace; and

an outer trace coupled to a lower surface of said substrate, said inner trace being electrically coupled to said outer trace.

12. The package of claim 9 wherein said runner surface extends between said pocket and said overflow reservoir.

13. The package of claim 9 wherein said mating surface extends from said drain outer sidewall surface.

14. The package of claim 9 wherein said pocket base surface is below said drain base surface.

15. The package of claim 11 further comprising an interconnection pad coupled to said outer trace.

16. The package of claim 11 further comprising an interconnection ball coupled to said outer trace.

17. A package comprising:

a substrate comprising;

a pocket;

a pocket base surface;

a pocket sidewall surface, said pocket base surface and said pocket sidewall surface defining said pocket;

an overflow reservoir around a periphery of said pocket;

a drain base surface;

a drain inner sidewall surface;

a drain outer sidewall surface, said drain base surface, said drain inner sidewall surface, and said drain outer sidewall surface defining said overflow reservoir;

a mating surface around a periphery of said overflow reservoir and extending from said drain outer sidewall surface; and

a runner surface extending between said drain inner sidewall surface and said pocket sidewall surface, wherein said runner surface is below said mating surface;

a first electronic component coupled within said pocket;

a sealing encapsulant filling said pocket, said sealing encapsulant comprising an exterior surface coplanar with said mating surface; and

excess encapsulant within said overflow reservoir.

18. A package comprising:

a substrate comprising;

a pocket;

an overflow reservoir around a periphery of said pocket;

a runner surface extending between said pocket and said overflow reservoir; and

a mating surface around a periphery of said overflow reservoir;

a first electronic component coupled within said pocket;

a sealing encapsulant filling said pocket, said sealing encapsulant extending over and above said runner surface; and

excess encapsulant within said overflow reservoir.

19. The package of claim 18 wherein said sealing encapsulant comprises an entirely planar exterior surface extending over and above said runner surface.

20. The package of claim 18 wherein said sealing encapsulant comprises an exterior surface, said exterior surface comprising a planar central region and a non-planar peripheral region.