×

Enhanced memory module architecture

  • US 6,765,812 B2
  • Filed: 01/17/2002
  • Issued: 07/20/2004
  • Est. Priority Date: 01/17/2001
  • Status: Active Grant
First Claim
Patent Images

1. A memory module comprising:

  • a printed circuit assembly having connector pads at one edge of said assembly; and

    a plurality of memory sockets mounted on said assembly and electrically coupled to said connector pads wherein said printed circuit assembly is adapted to support both synchronous and asynchronous types of said memory devices in the memory sockets.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×