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Stack type flip-chip package

  • US 6,768,190 B2
  • Filed: 04/23/2002
  • Issued: 07/27/2004
  • Est. Priority Date: 01/25/2002
  • Status: Active Grant
First Claim
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1. A stack type flip-chip package, comprising:

  • a substrate board having a surface with a plurality of bump contacts and a plurally of line contacts thereon;

    a first chip having a first active surface and a back surface, wherein the first active surface has a plurality of first bonding pads thereon;

    a redistribution circuit layer on the back surface of the first chip, wherein the redistribution circuit layer has a plurality of bump pads and a plurality of line pads thereon;

    a passivation layer on the back surface of the first chip, exposing the bump pads and the line pads of the redistribution circuit layer;

    a second chip having a second active surface with a plurality of second bonding pads thereon;

    a plurality of bumps, wherein a portion of the bumps are disposed between the bump contacts and the first bonding pads, and a portion of the bumps are disposed between the bump pads and the second bonding pads;

    a plurality of conductive wires for connecting between the line contacts and the line pads;

    a packaging material, used for enclosing the first chip, the second chip and the conductive wires; and

    an underfill material filling the space between the first chip and the substrate and filling the gap between the first chip and the second chip.

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