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Wafer-level contactor

  • US 6,768,331 B2
  • Filed: 04/16/2002
  • Issued: 07/27/2004
  • Est. Priority Date: 04/16/2002
  • Status: Expired due to Term
First Claim
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1. A contact housing adapted for receiving a plurality of compliant contacts, the contact housing for use to engage a wafer-under-test, the wafer-under-test having a wafer coefficient of thermal expansion and including an array of conductive contact pads disposed in a wafer-level-packaged pattern, the contact housing including:

  • a first plate formed with a first pattern of apertures, the first pattern of apertures corresponding to at least a portion of the wafer-level-packaged pattern, the first plate consisting only of a material having a coefficient of thermal expansion matching the wafer coefficient of thermal expansion; and

    a second plate formed with a second pattern of apertures, the second pattern of apertures disposed in a spaced-apart relationship for registering vertically with the first pattern of apertures, the first and second plates cooperating to define a plurality of contact receptacles for nesting the compliant contacts.

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