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Infrared correction in color scanners

  • US 6,768,565 B1
  • Filed: 09/07/2000
  • Issued: 07/27/2004
  • Est. Priority Date: 09/07/2000
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a main surface including first, second and third linear arrays of photosites and bonding pads defined in the main surface, each linear array including a plurality of photosites;

    a clear layer deposited over the main surface exclusive of the bonding pads;

    a first primary color filter layer deposited over the first linear array;

    a second primary color filter layer deposited over the second linear array; and

    a third primary color filter layer deposited over a first subset of photosites in the third linear array, and an infrared filter layer deposited over a second subset of photosites in the third linear array.

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